Diamond electroplating equipment and electroplating method thereof

Abstract

The invention discloses a diamond electroplating device and an electroplating method thereof. The diamond electroplating device comprises a servo paying-off device, an electrolysis oil removing device, a constant-tension adjusting device, a sand blowing and stirring device, a wire arranging and take-up device and a master control system. The servo paying-off device, the electrolysis oil removing device, the sand blowing and stirring device and the wire arranging and take-up device are sequentially connected. The servo paying-off device, the electrolysis oil removing device, the sand blowing and stirring device and the wire arranging and take-up device are all connected with the constant-tension adjusting device. The constant-tension adjusting device is used for controlling tension of wires to be kept consistent. The servo paying-off device, the electrolysis oil removing device, the constant-tension adjusting device, the sand blowing and stirring device and the wire arranging and take-up device are all electrically connected with the master control system. The master control system is used for controlling work of all the devices. By means of the improvement, the diamond electroplating device and the electroplating method thereof have the beneficial effects that the occupied area is small, the equipment layout is reasonable, functions are powerful, the automation degree is high, the failure rate is low, maintenance is convenient, energy conservation and environment friendliness are achieved, and the production efficiency is high.

Description

technical field [0001] The invention relates to the field of electroplating equipment, in particular to a diamond electroplating equipment and an electroplating method thereof. Background technique [0002] With the formulation and implementation of the national new energy strategic plan and the development of the semiconductor industry, especially the demand for large size of solar cells is increasing, the thickness of silicon wafers is continuously reduced, and the cutting accuracy is getting higher and higher. The production equipment requirements for wire saws are also getting higher and higher. At present, most of the cutting of hard and brittle materials such as silicon crystals is still using more traditional free abrasive cutting. The cutting principle is to use the rapid movement of the steel wire to bring the liquid containing abrasive into the kerf of the workpiece to produce cutting effect. This cutting method has problems such as low cutting efficiency, difficu...

AI Technical Summary

Problems solved by technology

Consolidated abrasive tools mean that diamond abrasives are plated on steel wires by electroplating. At present, most domestic diamond electroplating equipment has large floor space, high energy consumption, messy equipment layout, high failure rate, low efficiency, and produced products. Disadvantages such as low pass rate

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