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Miniaturized and ruggedized wafer level MEMS force sensors

A technology of force sensor and wafer, applied in the field of MEMS force sensing die, can solve the problems of lack of force sensing technology, robustness, fragmentation, large die, etc.

Active Publication Date: 2016-09-07
触控解决方案股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Contact pads are provided around the diaphragm, which makes existing force dies relatively large
Additionally, existing MEMS force dies are fragile, lack the robustness of other force-sensing technologies such as force-sensitive resistors, and are prone to shattering from the external environment

Method used

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  • Miniaturized and ruggedized wafer level MEMS force sensors
  • Miniaturized and ruggedized wafer level MEMS force sensors
  • Miniaturized and ruggedized wafer level MEMS force sensors

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Embodiment Construction

[0025] The present invention may be understood more readily by reference to the following detailed description, examples, drawings and preceding and following descriptions thereof. However, before the devices, systems and / or methods of the present invention are disclosed and described, it is to be understood that, unless otherwise indicated, the present invention is not limited to the specific devices, systems and / or methods disclosed herein, as the present invention may of course be is changing. It is also to be understood that terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting.

[0026] The following description of the invention is presented as an enabling teaching of the invention in its best presently known embodiment. For this reason, those skilled in the relevant art(s) will recognize and appreciate that various changes can be made in the various aspects of the invention described herein while still obtain...

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Abstract

Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

Description

[0001] This application claims U.S. Provisional Application No. 61 / 926,472, filed January 13, 2014, U.S. Provisional Application No. 61 / 937,509, filed February 8, 2014, and U.S. Provisional Application No. 61 / 937,509, filed May 29, 2014. 62 / 004,264 entitlement. technical field [0002] The present invention relates to MEMS force sensing dies for converting force into strain, which is sensed by piezoresistive strain gauges. Background technique [0003] Prior art MEMS force dies are based on correlating an applied force to the center of a sensing diaphragm comprising four piezoresistive strain gauges. Contact pads are provided around the diaphragm, which makes existing force dies relatively large. Additionally, existing MEMS force dies are fragile, lack the robustness of other force sensing technologies such as force sensitive resistors, and are prone to shattering from the external environment. [0004] Therefore, there is a need in the related art for a small, low cost si...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/18B81B7/02
CPCG01L1/18B81C1/00626B81B2201/0292G01L1/205G01L9/0047G01L9/0048B81B2201/0264B81B3/0056
Inventor A·布罗施R·戴斯特儿霍斯特S·纳斯里
Owner 触控解决方案股份有限公司
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