Gas collection device and gas collection method for volatilized gas during epoxy resin curing

A technology for epoxy resin curing and volatile gas, which is applied in the direction of measuring devices, sampling devices, instruments, etc., can solve the problems of low volatility, low curing agent, and no clear device and method for volatile gas, so as to ensure accuracy and The effect of stability

Inactive Publication Date: 2016-09-07
RES INST OF PHYSICAL & CHEM ENG OF NUCLEAR IND
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the extremely low volatility of the epoxy resin itself, the proportion of the curing agent in the entire resin system is very low, and most of the volatile gases are generated during the high-temperature curing process, so how to collect the volatile gases during the curing process of the epoxy resin has not yet been solved Definite device and method

Method used

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  • Gas collection device and gas collection method for volatilized gas during epoxy resin curing
  • Gas collection device and gas collection method for volatilized gas during epoxy resin curing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] (i) Pouring epoxy resin

[0050] At room temperature, put JEL-55 epoxy resin and modified amine curing agent into a beaker, where the mass percentage of epoxy resin and curing agent is 3:1, and use a glass rod to stir the epoxy resin and curing agent evenly , place the glass rod obliquely in the filling pipe 2, and pour the above mixture into the gas collecting bottle 1 along the glass rod.

[0051] (ii) Connecting Fixtures

[0052] Put the sealing ring on the annular contact surfaces of the upper connecting plate 9 and the lower connecting plate 10, and fix the upper connecting plate 9 and the lower connecting plate 10 by the screw rod 7.

[0053] (iii) Curing epoxy resin

[0054] Turn the control valve 6 to move the piston 8 downwards to ensure that the piston 8 is under the outlet pipe 4. After the adjustment is completed, place the device in a drying oven, solidify at a temperature of 60°C for 6 hours, and cool in the furnace.

[0055] (iv) Gas collection

[005...

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Abstract

The invention discloses a gas collection device for volatilized gas during epoxy resin curing, comprising a gas collection provided with a charging tube at its upper end; the charging tube is communicated with a gas collection barrel above, the upper outer wall of the gas collection barrel is provided with an exhaust tube, the upper end of the gas collection barrel is provided with a conical sleeve, the lower end of a control valve above the sleeve is connected with a screw, and the screw passes through the sleeve to be connected with a piston in the gas collection barrel. A gas collection method for volatilized gas during epoxy resin curing includes the following steps: charging epoxy resin, connecting with a fixture, curing the epoxy resin, collecting gas, and testing ingredients. The problem that it is difficult to sample volatilized gas during epoxy resin curing is solved effectively, and the accuracy and stability of volatilized gas sampling is guaranteed; the substance ingredients and concentrations of the volatilized gas are determined by detection, protective measures are provided specially for workers, and health of the workers is guaranteed.

Description

technical field [0001] The invention belongs to a gas collection device and a collection method, in particular to a gas collection device and method for volatilized gas during the curing process of epoxy resin. Background technique [0002] During the curing process of epoxy resin and amine curing agent or acid anhydride curing agent, a small amount of unknown volatile gas will be generated. With the hygienic evaluation of chemical products receiving more and more attention, it is imperative to clarify the composition and concentration of volatile gases. Due to the extremely low volatility of the epoxy resin itself, the proportion of the curing agent in the entire resin system is very low, and most of the volatile gases are generated during the high-temperature curing process, so how to collect the volatile gases during the curing process of the epoxy resin has not yet been solved Definite devices and methods. Contents of the invention [0003] The present invention is p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/24G01N30/88G01N30/06
CPCG01N1/24G01N30/06G01N30/88
Inventor 梁泽慧刘渊郭磊毕艳孙炳君刘明虹姚光晔杨佩雯张艳刘佳
Owner RES INST OF PHYSICAL & CHEM ENG OF NUCLEAR IND
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