Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Strain sensor able to withstand large deformation in high temperature environment

A technology of strain sensor and high temperature environment, applied in the field of strain sensor, can solve the problems of difficulty in large deformation of optical fiber sensor, reduce the service life of optical fiber, etc., and achieve the effect of low cost and high reliability

Inactive Publication Date: 2016-08-31
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For the measurement of high temperature environment, the current application is more mature fiber optic sensor, but the fiber optic sensor can only measure the conventional strain, due to the characteristics of the fiber itself, such as the fiber attenuation caused by Rayleigh scattering, inherent absorption, bending and extrusion, etc., will reduce the optical fiber. The service life makes it difficult for fiber optic sensors to withstand large deformations

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Strain sensor able to withstand large deformation in high temperature environment
  • Strain sensor able to withstand large deformation in high temperature environment
  • Strain sensor able to withstand large deformation in high temperature environment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Hereinafter, embodiments of the present invention will be described in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention. Those skilled in the art will understand that unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the word "comprising" used in the description of the present invention refe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Pitchaaaaaaaaaa
Pitchaaaaaaaaaa
Diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a strain sensor able to withstand large deformation in a high temperature environment. The sensor relates to the technical field of mechanical sensors and is able to sense and measure largely deformed structures in a high temperature environment at low cost. The strain sensor comprises a protection box, springs and two sapphire fibers. The springs are cylindrical helical springs; the two sapphire fibers are integrated into different springs respectively. The protection box is formed by two oppositely arranged moveable boxes. The two sapphire fibers are sealed in the protection box, connected to the two boxes forming the protection box through one end of their own and closely attached to the surfaces of the structures at two sides of the protection box through high temperature withstanding adhesive agent. The springs integrated by one sapphire fiber and the protection box are in fixed arrangement to measure strains. The springs integrated by the other sapphire fiber and the protection box are not in fixed arrangement so as to measure the deformation caused by an environment to the sapphire fiber. The invention finds applications for large deformation measurement in a high temperature environment.

Description

technical field [0001] The invention relates to the technical field of mechanical sensors, in particular to a strain sensor subjected to large deformation in a high-temperature environment. Background technique [0002] With the continuous development of aircraft design technology, the operating environment of aircraft has become more and more complex. Harsh environments such as high temperature, high pressure, and corrosion will have a certain impact on the aircraft structure. In order to accurately grasp the situation of the aircraft structure in flight test and daily maintenance, especially in high temperature environment, the strain sensor is used to detect the stress change of the aircraft structure. Moreover, the concept of a flexible structure is also proposed in the current design, and the deformation of the flexible structure will be larger than that of the conventional structure. [0003] For the measurement of high temperature environment, the current application...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01B11/16
CPCG01B11/16
Inventor 周丽陆深波邱涛
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products