Method for reducing machining stress concentration of glass hole

A technology for processing stress and glass holes, which is applied in the direction of stone processing tools, stone processing equipment, manufacturing tools, etc., can solve problems such as stress concentration, achieve the effects of eliminating stress concentration, avoiding large chipping, and facilitating repair

Active Publication Date: 2016-08-17
GUILIN CHAMPION UNION DIAMOND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention, in view of the above problems, provides a method for reducing the stress concentration of glass hole processing, realizes small chipping of end faces and inner chamfers, no interface,...

Method used

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  • Method for reducing machining stress concentration of glass hole
  • Method for reducing machining stress concentration of glass hole
  • Method for reducing machining stress concentration of glass hole

Examples

Experimental program
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Effect test

Embodiment 1

[0064] Set the glass thickness H, the hole diameter is Φ, the ring width b of the chamfer on the glass end face, and the glass thickness h of the hole wall after hole processing meets the strength requirements of the glass;

[0065] A method for reducing stress concentration in glass hole processing, comprising the following steps:

[0066] Step 1. Assemble the chamfering drill bit, put the end 4 with an outer diameter smaller than the set glass hole diameter close to the drill bit working ring 2, the chamfering ring 3 is on the rear side of the drill bit working ring 2 and the chamfering ring 3 is assembled on the drill bit base 1 ; The outer diameter φ1 of the terminal 4 is smaller than the aperture Φ of the set glass hole, where 0.5㎜≤Φ-φ1≤2㎜;

[0067] Step 2. Drilling process, the drill bit drills a transition groove on the lower end face of the glass 5, the depth of the drill groove at the outer diameter of the end face of the drill bit working ring 2 is less than the set ...

Embodiment 2

[0084] The glass used for solar cells has a thickness of H=1.8㎜ and a hole diameter of Φ=20㎜. Since the glass is under stress when the battery components are laminated, the stress concentration of the glass hole processing is one of the important factors for glass bursting, so it needs to be reduced. Stress concentration in hole machining.

[0085] Such as figure 1 As shown, in order to ensure the strength of the glass, the thickness of the hole wall is set not less than h=1.2㎜, in order to reduce the stress concentration, the chamfer width of the hole processing end face is b=0.5㎜, and the axial angle θ=60° (that is, the radial The included angle is 30°, D2 is the outer chamfer depth of the upper drilling process, and D1 is the inner chamfer depth of the second down drilling process. The calculation shows that: D2 = D1 = 0.29㎜), so that the 90° right angle of the hole becomes an obtuse angle (ie The angle of chamfering during secondary drilling is 90°+30°=120°).

[0086] Th...

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Abstract

The invention relates to a method for reducing machining stress concentration of a glass hole. The method comprises the following steps: assembling a chamfer bit, enabling the end with external diameter smaller than the aperture of the glass hole to get close to a drill bit working ring; arranging a chamfer ring at the rear side of the drill bit working ring and assembling the chamfer ring on a drill bit basal body; carrying out drilling-down machining, wherein the drill bit drills through a transitional slot at the lower end face of the glass, and the drill slot depth at the external diameter of the drill bit working ring is smaller than the set chamfer depth of the lower end face of the glass; carrying out drilling-up machining, wherein the drill bit carries out hole drilling and outer chamfer drilling at the upper end face of the glass, corresponding to the transitional slot, and drills at the external diameter part of the end face of the drill bit working ring until reaching the bottom of the transitional slot or running through the bottom of the transitional slot; carrying out secondary drilling-down machining, wherein the drill bit carries out inner chamfer drilling at the transitional slot of the glass, and thus completing machining of the glass hole. The method can realize little edge breakage of the end face and the inner chamfer, can avoid forming of junction gaps, can form a uniform and smooth hole wall, and can ensure that the inner chamfer is an obtuse angle, thus solving or relieving the problem of stress concentration in machining of the glass hole, and ensuring the strength of the glass.

Description

technical field [0001] The invention relates to the technical field of glass processing, in particular to a method for reducing stress concentration in glass hole processing. Background technique [0002] Glass hole processing is generally carried out with diamond tools manufactured by powder metallurgy, usually referring to drilling and chamfering. The prior art also uses electroplated diamond tools, but because it is a surface-mounted tool, the service life is short, and the manufacturing method is not conducive to environmental protection, so it is gradually abandoned. [0003] At present, thin glass generally adopts the counter-drilling process, which drills holes in opposite directions. This method transfers and alleviates the phenomenon of large edge chipping on the glass end surface when the one-way drill penetrates through and alleviates it to the interface in the middle of the glass. However, due to the influence of factors such as the assembly accuracy of the mach...

Claims

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Application Information

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IPC IPC(8): B28D1/14
CPCB28D1/146
Inventor 宋京新蔡元沛龙慧玲宿恒郭新玲梁安宁王志勇任杰
Owner GUILIN CHAMPION UNION DIAMOND CO LTD
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