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Packaging structure of single-chip bidirectional single IGBT

A packaging structure, single-chip technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of difficult packaging, weak heat dissipation of IGBT single tube, etc., and achieve the effect of improving power density

Inactive Publication Date: 2016-07-20
HUNAN UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The purpose of the present invention is to provide a single-chip bidirectional IGBT single-tube packaging structure, which solves the difficulty in packaging caused by the characteristic of the existing single-chip bidirectional IGBT device "two electrodes are coplanar", and the IGBT single-tube obtained by traditional packaging The problem of weak heat dissipation

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Embodiment Construction

[0033] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0034] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "top", "bottom" etc. are based on the Orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be...

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Abstract

The invention relates to a packaging structure of a single-chip bidirectional single IGBT. The packaging structure comprises a bottom metal plate and a top metal plate. A single-chip bidirectional IGBT device is arranged between the bottom metal plate and the top metal plate. The top metal plate covers and closely clings to the first emission electrode of the single-chip bidirectional IGBT device. The bottom metal plate covers and closely clings to the second emission electrode of the single-chip bidirectional IGBT device. Proper insulation spacing is maintained between the top metal plate and a first gate electrode. Proper insulation spacing is maintained between the bottom metal plate and a second gate electrode. The two emission electrodes are respectively connected with the corresponding bottom metal plate and the top metal plate so that the problem of difficulty of packaging caused by "two coplanar electrodes" of the single-chip bidirectional IGBT device can be solved, the appearance and the packaging technology of the single-chip bidirectional single IGBT are enabled to be compatible with those of a conventional discrete inverse impedance single IGBT, and the single-chip bidirectional single IGBT is enabled to have two-sided heat radiation capacity and power density can be enhanced.

Description

technical field [0001] The invention relates to the technical field of power semiconductor devices, in particular to a single-chip bidirectional IGBT single-tube packaging structure. Background technique [0002] An insulated-gate bipolar transistor (IGBT) is a power electronic device that combines the advantages of a metal-oxide-semiconductor field-effect transistor (MOSFET) and a bipolar junction transistor. IGBT has been widely used due to its excellent performance, which greatly improves the performance of power electronic devices and systems. [0003] Traditional AC-DC-AC converters (AC-DC-AC converters) require large-capacity capacitors to maintain the stable operation of the intermediate DC link (DC link), which makes the converter larger in size and weight. In addition, compared with power devices, the service life of capacitors is obviously insufficient, which affects the reliability and service life of the converter. The AC-AC converter (AC-AC converter) eliminat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/739H01L23/367H01L23/492
CPCH01L29/7393H01L23/367H01L23/492
Inventor 曾重敖杰王俊沈征
Owner HUNAN UNIV
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