Lead frame handling system for semiconductor packaging systems

Abstract

The invention discloses a lead frame clamping system used in a semiconductor packaging system. The lead frame clamping system comprises a clamping system, wherein the clamping system comprises a material loading clamping device and a material fetching clamping device; the material loading clamping device and the material fetching clamping device comprise multiple pairs of pneumatic manipulators; each of the pneumatic manipulators comprises an air cylinder which is provided with a piston rod therein; the side wall of the air cylinder is rotationally connected to a clamping jaw whose section is inverted-L shaped; one end of the clamping jaw is positioned outside the air cylinder, and the other end is extended in the air cylinder; the middle section of the piston rod is provided with a circle of recessed part adaptive to the clamping jaw end part; the bottom, positioned outside the air cylinder, of the clamping jaw is provided with a claw hook. According to the system, the material loading clamping device and the material fetching clamping device both adopt multiple pairs of pneumatic manipulators for series actions; during operation, the pneumatic manipulators are distributed at two sides of the lead frame and timely, accurately and quickly clamp the lead frame; the clamping jaw stays open status at the beginning; the problem of lead frame deformation due to the clamping jaw hitting on the lead frame during clamping the lead frame can be avoided.

Description

technical field [0001] The invention relates to semiconductor packaging clamping technology, in particular to a lead frame clamping system for semiconductor packaging system. Background technique [0002] At present, the integration level of semiconductor packaging is getting higher and higher. In order to improve efficiency, the lead frame also tends to be wider and longer. However, manual operation is necessary for long, wide, thin, and highly integrated lead frame grippers. , It is easy to cause lead frame deformation, gold wire breakage and other phenomena, resulting in unguaranteed product quality. The existing lead frame clamping system in use is to install several manipulators on a large fixed plate, and then drive the fixed plate to move through the cylinder to control the manipulators. This structure is more complicated, and it is easy to disassemble and maintain. Convenience, when the lead frame is wide, long and the material is thin, the fixed plate is easily def...

AI Technical Summary

Problems solved by technology

[0002] At present, the integration level of semiconductor packaging is getting higher and higher. In order to improve efficiency, the lead frame also tends to be wider and longer. However, manual operation is necessary for long, wide, thin, and highly integrated lead frame grippers. , it is easy to cause lead frame deformation, gold wire breakage and other phenomena, resulting in unguaranteed product quality

The existing lead frame clamping system in use is to install several manipulators on a large fixed plate, and then drive the fixed plate to move through the cylinder to control the manipulators. This structure is more complicated, and it is easy to disassemble and maintain. Convenience, when the lead frame is wide, long and the material is thin, the fixed plate is easily deformed during the action, and it is often difficult for the manipulator to accurately grasp the product, or the lead frame is deformed when grasping, thus affecting the quality of the product

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