Fastening jig

Abstract

The invention provides a fastening jig, which comprises a base, a pressure lever base and a plurality of pressure levers, wherein each of two sides of the base is connected with a support part; the pressure lever base is connected between the upper ends of two support parts; the pressure lever base and the base are arranged in parallel; a plurality of slide chutes which penetrate up and down are formed in the pressure lever base; the plurality of slide chutes are arranged along the periphery of the central line of the pressure lever base; and the plurality of pressure levers pass through the slide chutes and can slide in the slide chutes. According to the fastening jig provided by the invention, pressing stabilization is carried out on piezoelectric ceramic chips placed on the base through the plurality of pressure levers; the piezoelectric ceramic chips are stressed uniformly; bending deformation of the piezoelectric ceramic chips due to solidification of a high-molecular polymer can be effectively prevented; and meanwhile, the pressure levers can move in the slide chutes, so that the fastening jig provided by the invention can be compatible with the piezoelectric ceramic chips with different sizes.

Description

technical field [0001] The invention relates to a fastening fixture, in particular to a fastening fixture for leveling piezoelectric composite materials. Background technique [0002] During the preparation process of the piezoelectric ceramic sheet of the two-dimensional area ultrasonic probe using the cut-fill method, after the piezoelectric ceramic sheet is filled with a liquid polymer, the polymer will solidify and shrink during the curing process. Internal stress is generated inside the electric ceramic sheet, so that the piezoelectric ceramic sheet after glue filling is bent and deformed. [0003] In order to avoid bending and deformation of piezoelectric ceramic sheets after glue filling, a leveling device is provided in the prior art, such as figure 1 As shown, it includes a base 10, a pressure plate 70, a vertical support rod 30, a horizontal support rod 40, a pressure rod 60 and a screw cap 50, wherein the base 10 is provided with a groove 20, and the opposite sid...

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Problems solved by technology

[0004] However, this leveling device has the following defects: due to the high viscosity of the polymer, the piezoelectric ceramic sheet after glue filling will adhere to the groove 20 after curing, making it difficult for the piezoelectric ceramic sheet to move from the groove In the process of using the leveling device, since the piezoelectric ceramic sheet is flattened by the pressure plate 70, the piezoelectric ceramic sheet needs to be filled with glue first, and then the piezoelectric ceramic sheet after the glue filling is used. Fastening operation, the fastening operation after the glue filling is easy to overflow the high molecular polymer poured into the groove 20, resulting in the lack of glue inside the piezoelectric ceramic sheet, and even the phenomenon of pores

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