Non-contact transmission and positioning platform device and control method thereof

Abstract

The invention discloses a non-contact transmission and positioning platform device and a control method thereof. The device comprises a transmission platform, a fixed platform and a base, wherein the fixed platform is arranged under the transmission platform, the base is arranged under the fixed platform, the fixed platform is connected with the base by a fixed platform support, a plurality of grooves are formed in the transmission platform, each groove is provided with an air inlet hole and an air outlet hole, the air inlet hole is connected with an air inlet hose, the air inlet hose is connected with a positive pressure gas source, the air outlet hole is connected with an air outlet hose, and the air outlet hose is connected with a negative pressure gas source. In the non-contact transmission and positioning platform device, air is in a horizontal flowing state in the grooves, thus, a workpiece can be driven to move to the greatest extent by means of an airflow viscosity force, a relatively high moving acceleration speed is acquired, complete non contact in a real sense can be achieved, static pollution is difficult to generate when airflow is in contact with a semiconductor workpiece, and concentrated stress at a position near to a contact point is difficult to cause.

Description

technical field [0001] The invention relates to a non-contact transportation and positioning platform device and a control method, and belongs to the technical field of non-contact transportation and positioning of semiconductor silicon wafers. Background technique [0002] The new generation of silicon wafer manufacturing requires that it must adopt a frictionless and non-contact method during the production transfer process to ensure that the surface is clean and free from damage. How to realize the safe transportation and positioning of extremely brittle and thin silicon wafers is a very important manufacturing and assembly technology, and a key link to ensure production efficiency and yield. Traditional contact positioning methods (using rollers, suction cups and other contact methods) are likely to cause scratches and cracks on the surface of semiconductor workpieces. At the same time, there are many problems such as static electricity and metal pollution, which cannot ...

AI Technical Summary

Problems solved by technology

[0006] 1) The flow rate of the airflow ejected from the nozzle is small, the driving ability is limited, and the acceleration of the workpiece movement is small; 2) There are horizontal components and vertical components in the oblique airflow, and the vertical component is likely to cause the appearance of unstable disturbance of the workpiece; 3) Electrostatic pollution is likely to occur when the ejected high-speed airflow comes into contact with semiconductor workpieces, and stress concentration is likely to occur near the contact point

4. The air flow direction of the nozzle is limited, which is not conducive to the motion control of the workpiece

[0007] In the prior art, there is also a device that utilizes the viscous force of the airflow to drive the workpiece to move without contact, "an air flotation transportation device" (application publication number is 201410626307.2). Although this method can realize non-contact transportation, it lacks the The pose detection and control function of the system cannot achieve precise positioning of the object. In addition, the drive unit adopts the method of all air supply, which also leads to a significant increase in air consumption

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