semiconductor refrigeration equipment

Abstract

The invention provides semiconductor refrigerating equipment which comprises a shell, heat conducting liners and semiconductor refrigerating assemblies. Each semiconductor refrigerating assembly comprises a semiconductor refrigerating module, a cold-end heat radiator and a hot-end heat radiator, wherein the hot-end heat radiator is connected to the hot end of the semiconductor refrigerating module. Each cold-end heat radiator comprises a heat conductor and a plurality of heat pipes, wherein the heat pipes are connected to the heat conductor. Each heat conductor is connected to the cold end of the corresponding semiconductor refrigerating module. The heat pipes bend and extend to be attached to the heat conducting liners. Positioning pieces are arranged on the bent portions of the heat pipes. The positioning pieces are fixed to the heat conducting liners. The heat conducting liners are located in the shell. The space between the shell and the heat conducting liners is filled with a foaming layer. The heat pipes and the positioning pieces are embedded in the foaming layer. The bent heat pipes are positioned through the positioning pieces, and therefore the heat pipes can be installed on and fixed to the heat conducting liners firmly and reliably. The positions of the heat pipes can be effectively limited through the positioning pieces in the foaming process, the effect that the accurate positions of the heat pipes remain unchanged after foaming is finished is guaranteed, and thus the assembling reliability is improved.

Description

technical field [0001] The invention relates to a refrigeration device, in particular to a semiconductor refrigeration device. Background technique [0002] At present, refrigeration equipment (such as refrigerators, freezers, and wine cabinets) is an electrical appliance commonly used in people's daily life. Refrigeration equipment usually has a refrigeration system. Generally, the refrigeration system is composed of a compressor, a condenser, and an evaporator, which can achieve a lower temperature. of refrigeration. However, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is also widely used. The semiconductor refrigeration equipment in the prior art releases cold energy through the cold end of the semiconductor refrigeration module through the heat pipe to cool the storage space in the box. However, in the actual use process, the heat pipe is attached to the liner in the b...

AI Technical Summary

Problems solved by technology

However, in the actual use process, the heat pipe is attached to the liner in the box, and the heat pipe is prone to shift during the foaming process, which affects the assembly quality of the semiconductor refrigeration equipment, resulting in the failure of the semiconductor refrigeration equipment in the prior art. Assembly reliability is low

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