Numerical value general solution method for heat conduction heat source position recognition inverse problem
A numerical general solution and heat conduction technology, applied in electrical digital data processing, special data processing applications, instruments, etc., can solve problems such as time-consuming and difficult to solve
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0105] 实施例:以点源为例
[0106] 第1步:热传导源项位置识别反问题描述
[0107] 该一维热传导源项位置识别反问题的例子可描述为:一维问题,长为1m、中点作用5W点热源,一端指定温度10℃,另一端放置在环境温度为25℃的空气中;材料导热系数20,对流换热系数25。要求反演点热源的位置。
[0108] 本实例中涉及的有限元分析,可以使用目前通用的有限元分析软件,如Ansys、Cosmos等完成;
[0109] 第2步:确定点源反演的相关参数
[0110] 根据本发明提出的反演算法,首先确定点源反演的相关参数如下:
[0111] 1)设定点源位置可能的范围,即对x i1 ≤x i ≤x i2 ,取l / 4≤x i ≤3l / 4;
[0112] 2)在x=1位置取一个测量点,根据精确解考虑偏差后给出补充条件θ 11 =138(单位是摄氏度℃,下同,略);
[0113] 第3步:解齐次解和特解,构造通解
[0114] 根据本发明的数值通解方法,采用有限元法在测量点分别计算齐次解、x i1 、x i1 点作用5W点热源的特解,见 figure 1 and figure 2 ;提取测量点的温度值,有: θ 11 = 10 , θ q 11 1 = 72.5 , θ q 11 2 = 197.5.
[0115] 第4步:求解方程,得到热源位置参数
[0116] 根据公式(7)~(9),可得点源位置参数为:
[0117] α ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com