Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Plug-seedling planting method

A technology for raising seedlings in plug trays and plug trays is applied in the directions of botanical equipment and methods, cultivation, soilless cultivation, etc., which can solve the problems of less seedlings, long growth cycle, low survival rate, etc., and achieves shortened growth period and developed root system. , the effect of high seedling survival rate

Inactive Publication Date: 2016-06-15
沈阳东卓园艺科技有限公司
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing seedling planting method has a long growth cycle, a small amount of seedlings, and a low survival rate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] First, arrange and sterilize the mixture, pour the seedling substrate on the sterilized field, add the fungicide, then stir evenly, then pour water and stir until the hand can be held into a ball, the hand is loose or loose, and finally it should be fully mixed , put the mixed seedling substrate into the seedling tray and scrape it flat with a wooden board;

[0020] Put a hole of 0.5cm deep in each hole of the seedling tray filled with seedling substrate, put the dry seeds or germinated seeds into the hole, cover with a layer of mixed seedling substrate until the hole is flat, and then sow the seeds The seedling tray of kind is moved in the seedling shed; The composition of seedling substrate is calculated in parts by weight, peat 20L, vermiculite 8L, perlite 2L, zeolite 0.075Kg, balance fertilizer 0.05Kg, Jia Kefeng 0.015Kg;

[0021] During the seedling management period, control the water and spray water in time, and control the indoor humidity at 70%; in summer, choo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a plug-seedling planting method. The method comprises following steps: loading plug discs, sowing and performing seedling management. The plug-seedling planting method has following beneficial effects: seedlings sprout neatly at the high survival rate so that nutrition quality and output of plants are enhanced; and due to a reasonably-used seedling substrate, the plant growth period is shortened and yield and quality are improved.

Description

Technical field: [0001] The invention relates to a method for planting seedlings in plug trays. Background technique: [0002] The existing seedling raising and planting method has long growth period, less seedling raising amount and low survival rate. Invention content: [0003] The present invention just aims at above-mentioned problem, provides a kind of hole tray seedling cultivation planting method. [0004] In order to achieve the above object, the present invention adopts the following technical solutions, the specific steps are: [0005] (1) plug tray [0006] First, arrange and sterilize the mixture, pour the seedling substrate on the sterilized field, add the fungicide, then stir evenly, then pour water and stir until the hand can be held into a ball, the hand is loose or loose, and finally it should be fully mixed , put the mixed seedling substrate into the seedling tray and scrape it flat with a wooden board; [0007] (2) Sowing [0008] Put a hole of 0.5c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): A01G31/00
Inventor 马健
Owner 沈阳东卓园艺科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com