Groove milling method of whole large material of IC cards and groove milling device implementing groove milling method

Abstract

The invention relates to the field of upstream making of IC cards, in particular to a groove milling method of a whole large material of IC cards and a groove milling method implementing the groove milling method. The groove milling method comprises the following steps: dividing the whole large material into a plurality of IC card bases arrayed in M lines and N rows according to printing typesetting; conveying the whole large material to a groove milling station from a main channel and then positioning the whole large material; arranging at least one row of milling heads on a groove milling part and simultaneously milling grooves in the various IC card bases in the rows, wherein the whole rows of the milling heads arranged on the groove milling part have degrees of freedom of movement in three directions of an X axis, a Y axis and a Z axis; after groove milling on the various IC card bases on one row or multiple rows of the whole large material is finished, enabling one row or multiple rows of the whole large material to move to other rows in a stepping manner for groove milling until groove milling of the various IC card bases in the M lines and the N rows of the whole large material are finished completely. By the groove milling method of the whole large material of the IC cards and the groove milling device implementing the groove milling method, card making efficiency can be improved greatly, meanwhile, conveying time is saved, the service life of equipment can be prolonged under the condition that external factors are not changed, and machining precision in a production process is improved.

Description

technical field [0001] The invention relates to the field of upstream card making of IC cards, in particular to a method for milling grooves of an entire large material of IC cards and a groove milling device for implementing the method. Background technique [0002] The size of the IC card is 85.6mm×54mm according to the national unified standard. The card base material of the IC card is PVC (polyvinyl chloride), ABS and other plastic or paper. The single IC card on the market is divided into single card single core or one card multicore. At present, the process of producing IC cards is: printing of raw materials, synthesis of M×N whole aniseed material—blasting cutting—ISO7816 standard card—grooving—packaging—personalization. [0003] In the current card making process, only when printing the whole big material and gun-cutting the ISO7816 standard card, the whole big material will appear. In the real processing process, only the gun-cut ISO7816 standard card is used. The...

AI Technical Summary

Problems solved by technology

The existing milling process is limited by the size of the ISO7816 standard card. The number of milling slots on the ISO7816 standard card is limited. The milling of the same number of milling slots on the ISO7816 standard card wastes time during the transmission process, and every two IC cards are milled. It is difficult to control the relative position accuracy of

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