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Dry type wafer polishing device and method

A dry polishing and wafer technology, which is applied to grinding drives, grinding/polishing equipment, surface polishing machine tools, etc. Simple, balanced gravity, overall compact effect

Active Publication Date: 2016-05-25
CETC BEIJING ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide a wafer dry polishing device and method, which aims to solve the problems in the prior art that the dry polishing device has a complex structure, requires high precision for each component, and is difficult to control

Method used

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  • Dry type wafer polishing device and method

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Embodiment Construction

[0034] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0035] Embodiments of the present invention provide a wafer dry polishing device, such as figure 1 As shown, it includes: a pressure control system 1 arranged on the workbench for detecting the polishing pressure value, the pressure control system 1 includes a polishing mechanism 2; a cylinder 3 connected with the polishing mechanism 2 and a frame 5; and a polishing mechanism 2 A motor 4 connected to the frame 5 for driving the movement of the polishing mechanism 2; wherein, the cylinder 3 is fixedly connected to the polishing mechanism 2, and the motor 4 is located above the polishing mechanism 2 and connected to the polishing mechanism 2.

[0036] Specifically, the embodiments of the present invention are used for semiconductor special equipment for pr...

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Abstract

The invention provides a dry type wafer polishing device and method. The dry type wafer polishing device comprises a pressure control system which is arranged on a working table and used for detecting the polishing pressure value and comprises a polishing mechanism, cylinders connected with the polishing mechanism and a machine frame respectively, and a motor connected with the polishing mechanism and the machine frame respectively and used for driving the polishing mechanism to move. The cylinders are fixedly connected with the polishing mechanism. The motor is located above the polishing mechanism and connected with the polishing mechanism. By controlling pressure through pressure sensors, the design that constant-pressure polishing is achieved, the gravity of the polishing mechanism is balanced and buffered through the cylinders and the motor drives the polishing mechanism for feeding is achieved, and the device is compact in overall structure, easy to install, reliable in structure and stable in running.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer dry polishing device and method. Background technique [0002] In the manufacturing process of semiconductor special equipment, wafer dry polishing device and corresponding method are a key technology. In the existing grinding and polishing equipment, the common dry polishing device controls the feed during the polishing process through the cylinder pressure. The structure of this dry polishing device is complicated, and it has high requirements on the precision of components such as the cylinder, and there is also the problem that it is difficult to control. Contents of the invention [0003] The purpose of the embodiments of the present invention is to provide a wafer dry polishing device and method, aiming to solve the problems in the prior art that the dry polishing device has a complex structure, requires high precision of each component, and i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B41/04B24B47/20B24B49/16B24B1/00
CPCB24B1/00B24B29/02B24B41/04B24B47/20B24B49/16
Inventor 赵岁花衣忠波王仲康高岳张文斌刘国敬
Owner CETC BEIJING ELECTRONICS EQUIP
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