Wafer dry polishing device and method
A dry polishing and wafer technology, applied in the direction of grinding drive, grinding/polishing equipment, surface polishing machine tools, etc., can solve the problems of difficult control, complex structure, high precision requirements of each component, etc., and achieve simple installation , the overall structure is compact, the effect of balance gravity
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[0034] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.
[0035] Embodiments of the present invention provide a wafer dry polishing device, such as figure 1 As shown, it includes: a pressure control system 1 arranged on the workbench for detecting the polishing pressure value, the pressure control system 1 includes a polishing mechanism 2; a cylinder 3 connected with the polishing mechanism 2 and a frame 5; and a polishing mechanism 2 A motor 4 connected to the frame 5 for driving the movement of the polishing mechanism 2; wherein, the cylinder 3 is fixedly connected to the polishing mechanism 2, and the motor 4 is located above the polishing mechanism 2 and connected to the polishing mechanism 2.
[0036] Specifically, the embodiments of the present invention are used for semiconductor special equipment for pr...
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