Pipeline-type liquid heat-radiating device

Abstract

The invention relates to a pipeline-type liquid heat-radiating device, which adopts a brand-new design structure. A structure formed by mutual nesting of an outer pipe (1) and an inner pipe (2) is designed; through flow of the liquid designed in the inner pipe (2), temperature difference between gap environment between the outer pipe (1) and the inner pipe (2) and a region, the heat of which is to be dissipated, of the outer pipe (1) is generated; through vent holes (9) in the surface of the outer pipe (1), ventilation between the air in the region, the heat of which is to be dissipated, of the outer pipe (1) and the air in the gap environment between the outer pipe (1) and the inner pipe (2) is realized; and meanwhile, through intelligent detection of the region, the heat of which is to be dissipated, of the outer pipe (1) based on a temperature sensor (5), work of a fan (6) arranged at the open-mouthed end of the outer pipe (1) is controlled to realize accurate guidance of the flow of the air in the gap environment between the outer pipe (1) and the inner pipe (2), thereby effectively ensuring heat-radiating work efficiency of the pipeline-type liquid heat-radiating device in the actual application process.

Description

technical field [0001] The invention relates to a pipeline type liquid heat dissipation device, which belongs to the technical field of heat dissipation of electronic equipment. Background technique [0002] With the continuous development of electronic technology, all kinds of electronic products are constantly entering our daily life, ranging from large household appliances such as refrigerators and color TVs to small computer switch socket panels, all of which are products of the development of electronic technology. With the continuous development of electronic equipment, the heat generated by electronic equipment is gradually being valued by people. People find that the overheated environment will affect the performance of electronic products. For this reason, various heat dissipation devices have emerged and are being continuously improved. and innovation, such as patent application number: 201310622519.9, discloses a heat sink, including a body and a number of wavegui...

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Problems solved by technology

[0005] It can be seen from the above prior art that the existing heat dissipation devices are improved and innovated in structure and function to achieve heat dissipation for the heat generated by electronic equipment and ensure the working efficiency of electronic products. However, with the continuous improvement of heat dissipation devices It can be found that the existing heat dissipation devices still have unsatisfactory places. Most of the existing heat sinks are set in the heat area, and the heat is directly conducted to the external environment through the design structure. This is to achieve heat dissipation for the heat. However, the heat dissipated into the external environment will affect the external environment, and the existing heat dissipation methods are relatively common, that is, based on heat conduction materials and fans to achieve heat conduction, the actual heat dissipation efficiency is relatively low

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