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Parallel-microchannel water-cooling base plate

A water-cooled substrate and micro-channel technology, applied in arc welding equipment, manufacturing tools, welding equipment, etc., to ensure no deformation and reduce the deformation of aluminum plates

Inactive Publication Date: 2017-09-19
江苏海鼎电气科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The problem to be solved by the present invention is to propose an improvement plan or a replacement plan for the above-mentioned shortcomings in the prior art, especially a method to improve the cooling efficiency and avoid problems such as blockage of the flow channel of the water-cooled substrate during transient start-stop and flow fluctuations. improvements or alternatives to

Method used

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Embodiment Construction

[0015] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0016] Such as figure 1 , figure 2 Shown on the water cooling system loop. In the main circulation loop, the cooling medium (water) flows through the cooled device to cool it. At the same time, the medium absorbs heat and flows through the air cooler for secondary heat dissipation. The heat-dissipated medium enters the next cycle under the action of the main circulation pump. This goes back and forth; the voltage stabilization circulation system provides voltage stabilization for the water-cooled substrate circulation circuit and the secondary heat dissipation circuit; the main test platform frame is used to cooperate with the IGBT water-cooled substrate performance test and the assembly and support of its auxiliary equipment. Each data signal of the system is collected and processed by Agilent 34980A data acquisition instrument.

[0017] The water-cooled...

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Abstract

The invention discloses a parallel-microchannel water-cooling base plate. The parallel-microchannel water-cooling base plate is characterized in that the baes plate comprises an upper aluminum plate body, a lower aluminum plate body, a cooling water inlet and a cooling water outlet; water-cooling channels are formed in the lower aluminum plate body; the upper aluminum plate body and the lower aluminum plate body are connected through MIG welding; the cooling water inlet is formed in the right sides of the upper aluminum plate body and the lower aluminum plate body; the cooling water outlet is formed in the left sides of the upper aluminum plate body and the lower aluminum plate body; and the cooling water inlet and the cooling water outlet communicate with each other through the water cooling channels.

Description

technical field [0001] The invention relates to a cooling substrate, in particular to a parallel microchannel water cooling substrate. Background technique [0002] With the continuous increase of integration and power density of power electronic devices, it puts forward higher requirements for heat dissipation technology. Taking the insulated gate bipolar transistor (IGBT) as an example, the surface of the highly integrated IGBT package will generate a huge heat flux density. If the heat cannot be taken away in time, the surface temperature of the IGBT will rise. When the surface temperature exceeds the allowable temperature It will cause the failure or damage of the IGBT device when it is out of the range. [0003] Scholars at home and abroad have carried out extensive research on the heat dissipation of high-power power electronic devices. Among them, the liquid cooling (water cooling) technology using microchannel structure has been proved to be an efficient way for pow...

Claims

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Application Information

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IPC IPC(8): B23K9/173B23K9/32
CPCB23K9/173B23K9/32
Inventor 陶勇
Owner 江苏海鼎电气科技有限公司
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