Normally-off HEMT device with longitudinal grid structure and manufacturing method thereof
A gate structure, normally-off technology, which is applied in the field of normally-off HEMT devices and their preparation, can solve the problems of large threshold voltage, low device on-resistance and high switching rate, reduce device on-on resistance, etc., and achieve stability High threshold voltage and low on-resistance, reduced gate on-resistance, and good performance uniformity
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Embodiment 1
[0043] figure 2 It is a structural schematic diagram of a normally-off HEMT device with a vertical gate structure provided by an embodiment of the present invention. like figure 2 As shown, the normally-off HEMT device with a vertical gate structure provided by the embodiment of the present invention includes:
[0044] A substrate 1, a buffer layer 2, an i-GaN layer 3, a gate dielectric layer 7, and a passivation layer 9 are stacked, wherein one end of the i-GaN layer 3 and the side away from the buffer layer 2 are stepped;
[0045] The source electrode 5 covering between the ladder-shaped lower layer and the gate dielectric layer 7;
[0046] Covering the barrier layer 4 and the drain electrode 6 between the ladder-shaped upper layer and the gate dielectric layer 7, the drain electrode 6 is in contact with the barrier layer 4, wherein the drain electrode 6 is away from the ladder shape;
[0047] Cover the gate electrode 8 between the gate dielectric layer 7 and the passiv...
Embodiment 2
[0056] Figure 4 The implementation flow chart of the manufacturing method of the normally-off HEMT device with the vertical gate structure provided by the embodiment of the present invention. The method provided in this embodiment can manufacture a normally-off HEMT device with a vertical gate structure provided in any embodiment of the present invention. like Figure 4 As shown, the method for preparing a normally-off HEMT device with a vertical gate structure provided by an embodiment of the present invention includes:
[0057] Step 1, growing a buffer layer 2, an i-GaN layer 3 and a barrier layer 4 on a substrate 1 in sequence.
[0058] Figure 5a It is a structural diagram corresponding to this step of the method for fabricating a normally-off HEMT device with a vertical gate structure provided by an embodiment of the present invention. refer to Figure 5a , the specific process is: providing a substrate 1; forming a buffer layer 2 on the substrate 1; forming an i-Ga...
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