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Normally-off HEMT device with longitudinal grid structure and manufacturing method thereof

A gate structure, normally-off technology, which is applied in the field of normally-off HEMT devices and their preparation, can solve the problems of large threshold voltage, low device on-resistance and high switching rate, reduce device on-on resistance, etc., and achieve stability High threshold voltage and low on-resistance, reduced gate on-resistance, and good performance uniformity

Active Publication Date: 2016-05-11
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention mainly solves the technical problem that the existing normally-off HEMT devices cannot have uniform and stable large threshold voltage, low device on-resistance and high switching rate at the same time. In the off-type category, a normally-off HEMT device with a vertical gate structure and its preparation method are proposed to achieve stable and large-threshold voltage normally-off operation of the HEMT device while effectively reducing the on-resistance of the device

Method used

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  • Normally-off HEMT device with longitudinal grid structure and manufacturing method thereof
  • Normally-off HEMT device with longitudinal grid structure and manufacturing method thereof
  • Normally-off HEMT device with longitudinal grid structure and manufacturing method thereof

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Embodiment 1

[0043] figure 2 It is a structural schematic diagram of a normally-off HEMT device with a vertical gate structure provided by an embodiment of the present invention. like figure 2 As shown, the normally-off HEMT device with a vertical gate structure provided by the embodiment of the present invention includes:

[0044] A substrate 1, a buffer layer 2, an i-GaN layer 3, a gate dielectric layer 7, and a passivation layer 9 are stacked, wherein one end of the i-GaN layer 3 and the side away from the buffer layer 2 are stepped;

[0045] The source electrode 5 covering between the ladder-shaped lower layer and the gate dielectric layer 7;

[0046] Covering the barrier layer 4 and the drain electrode 6 between the ladder-shaped upper layer and the gate dielectric layer 7, the drain electrode 6 is in contact with the barrier layer 4, wherein the drain electrode 6 is away from the ladder shape;

[0047] Cover the gate electrode 8 between the gate dielectric layer 7 and the passiv...

Embodiment 2

[0056] Figure 4 The implementation flow chart of the manufacturing method of the normally-off HEMT device with the vertical gate structure provided by the embodiment of the present invention. The method provided in this embodiment can manufacture a normally-off HEMT device with a vertical gate structure provided in any embodiment of the present invention. like Figure 4 As shown, the method for preparing a normally-off HEMT device with a vertical gate structure provided by an embodiment of the present invention includes:

[0057] Step 1, growing a buffer layer 2, an i-GaN layer 3 and a barrier layer 4 on a substrate 1 in sequence.

[0058] Figure 5a It is a structural diagram corresponding to this step of the method for fabricating a normally-off HEMT device with a vertical gate structure provided by an embodiment of the present invention. refer to Figure 5a , the specific process is: providing a substrate 1; forming a buffer layer 2 on the substrate 1; forming an i-Ga...

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Abstract

The invention relates to the field of semiconductor devices, and provides a normally-off HEMT device with a longitudinal grid structure and a manufacturing method thereof. The HEMT device comprises a substrate, a buffer layer, an i-GaN layer, a grid dielectric layer and a passivation layer arranged in an overlapped mode, a source electrode coated between the ladder-shaped lower layer and the grid dielectric layer, a barrier layer and a drain electrode coated between the ladder-shaped upper layer and the grid dielectric layer, a grid electrode coated between the grid dielectric layer and the passivation layer, a source electrode pad passing through the passivation layer and the grid dielectric layer sequentially to contact with the source electrode, and a drain electrode pad passing through the passivation layer and the grid dielectric layer sequentially to contact with the drain electrode, wherein one end of the i-GaN layer and one side deviating from the buffer layer is ladder-shaped; the grid electrode has a Z-shaped section, the upper level of the grid electrode is located above the ladder-shaped upper layer, and the lower level is located above the ladder-shaped lower layer. The length of a grid electrode opening channel can be reduced, the grid on-state resistance of the device is reduced, and normally-off operation is realized.

Description

technical field [0001] The invention relates to the field of semiconductor devices, in particular to a normally-off HEMT device with a vertical gate structure and a preparation method thereof. Background technique [0002] Power switching devices are the core components of power electronics technology, and have been widely used in many fields of industrial production and social life. As global environmental and energy issues become increasingly prominent, researching the next generation of high-performance and low-loss power switching devices is one of the effective ways to improve power utilization and alleviate the global energy crisis. The next generation of power switching devices requires high performance index stability, low gate on-resistance, high switching speed, and requires normally-off (enhanced) operation characteristics in terms of safety, energy saving and simplified circuit design. The next-generation normally-off power switching device with mature technolog...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/778H01L21/335H01L29/423H01L29/10H01L21/28
CPCH01L21/28H01L29/1029H01L29/42316H01L29/66431H01L29/778
Inventor 黄火林孙仲豪梁红伟夏晓川杜国同边继明胡礼中
Owner DALIAN UNIV OF TECH
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