Array substrate and preparation method thereof, display panel and display device

A technology for array substrates and substrate substrates, applied in semiconductor/solid-state device manufacturing, optics, instruments, etc., can solve problems such as air bubbles and display panel gaps, avoid film gaps, avoid air bubbles, and improve high temperature and high humidity resistance Effect

Inactive Publication Date: 2016-05-11
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above problems, the present invention provides an array substrate and its preparation method, a display panel and a display device, which are used to solve the problem in the prior art that the expansion of the organic material layer causes gaps in the display panel, thereby forming bubbles

Method used

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  • Array substrate and preparation method thereof, display panel and display device
  • Array substrate and preparation method thereof, display panel and display device
  • Array substrate and preparation method thereof, display panel and display device

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Embodiment 1

[0043] figure 1 It is a schematic structural diagram of an array substrate provided in Embodiment 1 of the present invention. Such as figure 1 As shown, the array substrate includes a base substrate 101, the base substrate 101 includes a display area and a sealant coating area, the base substrate 101 is provided with a thin film transistor and an organic material layer 104, the organic The material layer 104 is disposed on the display area and the sealant coating area, and the organic material layer 104 located in the sealant coating area is provided with a thermal conduction layer 105 on the first surface away from the base substrate 101 . Optionally, a passivation layer 106 is disposed above the organic material layer 104 . The thermal conduction layer 105 is used to conduct heat, reducing the degree of thermal expansion of the organic material, thereby preventing the expansion of the organic material from affecting the junction force between the organic material layer, th...

Embodiment 2

[0048] image 3 It is a schematic structural diagram of an array substrate provided in Embodiment 2 of the present invention. Such as image 3As shown, the array substrate includes a base substrate 101, the base substrate 101 includes a display area and a sealant coating area, the base substrate 101 is provided with a thin film transistor and an organic material layer 104, the organic The material layer 104 is disposed on the display area and the sealant coating area, and the organic material layer 104 located in the sealant coating area is provided with a heat conduction layer 105 on the second surface close to the base substrate 101 . Optionally, a passivation layer 106 is disposed above the organic material layer 104 . The thermal conduction layer 105 is used to conduct heat, reducing the degree of thermal expansion of the organic material, thereby preventing the expansion of the organic material from affecting the junction force between the organic material layer, the ga...

Embodiment 3

[0053] Figure 4 It is a schematic structural diagram of an array substrate provided in Embodiment 3 of the present invention. Such as Figure 4 As shown, the array substrate includes a base substrate 101, the base substrate 101 includes a display area and a sealant coating area, the base substrate 101 is provided with a thin film transistor and an organic material layer 104, the organic The material layer 104 is disposed on the display area and the sealant coating area, and the organic material layer 104 located in the sealant coating area is away from the first surface of the base substrate 101 and close to the first surface of the base substrate 101. The two surfaces are provided with a heat conducting layer 105 . Optionally, a passivation layer 106 is disposed above the organic material layer 104 . The thermal conduction layer 105 is used to conduct heat, reducing the degree of thermal expansion of the organic material, thereby preventing the expansion of the organic ma...

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Abstract

The invention discloses an array substrate and a preparation method thereof, a display panel and a display device. The array substrate is characterized in that a heat conductive layer is arranged on the surface of an organic material layer; and the heat conductive layer plays a heat conduction role, thereby reducing heating expansion degree of the organic material, preventing expansion of the organic material from influencing bonding force between the organic material layer and a gate insulator layer and a passivation layer, and finally, preventing generation of gap between the organic material layer and the gate insulator layer as well as the passivation layer. The technical scheme can prevent gaps from being formed between the layers, and water vapor cannot enter a display region of the display panel through the gaps in the high temperature high moisture high pressure test, thereby preventing bubbles from appearing in the display region, improving high-temperature-resistant and high-moisture-resistant performance of the organic material layer, and finally, improving the reliability and the service life of the display device in severe environment.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate and a preparation method thereof, a display panel and a display device. Background technique [0002] In order to reduce power consumption in the existing display panel, an organic material layer is arranged between the gate insulating layer and the passivation layer of the display substrate. When this display product with an organic material layer is tested under high temperature, high humidity and high pressure, water vapor easily enters the display area from the edge of the display panel to form bubbles, which makes the display product fail the reliability test. Specifically, in a high-temperature and high-humidity environment, the organic film material is easy to expand when heated, and the expansion of the organic film material leads to poor adhesion between the organic material layer, the gate insulating layer, and the passivation layer, thereby ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1214H01L27/1259G02F1/133345G02F1/1362G02F2201/50H01L27/1248G02F1/133308G02F1/133311H01L21/77H01L27/12
Inventor 谭聪王凯张波詹成勇
Owner BOE TECH GRP CO LTD
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