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Lid for gas-tight seal and manufacturing method of the same, electronic component receiving package using the same

An air-tight sealing and manufacturing method technology, which is applied in the manufacture of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of thinning electronic parts that are not easy to achieve, and achieve the effect of improving air-tight sealing.

Active Publication Date: 2016-05-11
HITACHI METALS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the cover 1 made of a ceramic material needs to be thickened to ensure mechanical strength capable of being airtightly sealed, it is not easy to reduce the thickness of the electronic component housing package 10

Method used

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  • Lid for gas-tight seal and manufacturing method of the same, electronic component receiving package using the same
  • Lid for gas-tight seal and manufacturing method of the same, electronic component receiving package using the same
  • Lid for gas-tight seal and manufacturing method of the same, electronic component receiving package using the same

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Effect test

Embodiment

[0082] Examples of the present invention are disclosed below and described in detail. However, embodiments of the present invention are not limited to the examples of the present invention disclosed here.

[0083] In the cover 1 as an example of the present invention, the second metal layer 3 that contains more than 90% by mass of Ni and does not substantially contain Cr is clad and bonded to the first metal that is made of Fe-42Ni-6Cr alloy (426 alloy). Layer 2, and singulated by press processing. The thickness of the first metal layer 2 of the singulated lid 1 is 77 μm, and the thickness of the second metal layer 3 is 3 μm. The separated lid 1 was heat-treated for 30 minutes in a furnace set in a humid hydrogen atmosphere at a holding temperature of 850° C. and a dew point of +23.5° C. to form an oxide film layer 4 containing Cr to produce the lid 1 .

[0084] About the produced cover 1, the appearance photograph of the surface of the first metal layer 2 is shown in Figu...

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Abstract

The invention provides a lid for gas-tight seal, a manufacturing method of the lid, and an electronic part storage package. The lid is provided with a flat first metal layer; a second metal layer which is disposed on one surface of the first metal layer; and an oxidation skin film layer which is disposed on the other surface of the first metal layer. The section of the first metal layer is detected to contain 2 mass% to 8 mass% of Cr through SEM-EDX, and the section of the second metal layer is detected to contain less than 10 mass% of Cr through SEM-EDX. The section of the oxidation skin film layer is detected to contain more than 10 mass% of Cr through SEM-EDX. Moreover, the package is used for combining the lid and a ceramic frame body storing an electronic part through a glass combination layer. The package can achieve the reading of a laser mark and the recognition of information, improves the gas-tight reliability, and can achieve the thinning.

Description

technical field [0001] The present invention relates to an airtight sealing lid (lid), a manufacturing method thereof, and an electronic component storage package using the same. Background technique [0002] Conventionally, electronic components such as crystal resonators are sealed in airtight containers to prevent their characteristics from deteriorating. For example, figure 1 In the electronic component housing package 10 of the shown configuration, the cover 1 and the ceramic frame body 14 formed with the recessed electronic component housing portion 11a are bonded via the glass bonding layer 5, and the interior is hermetically sealed with bumps ( electronic components 12 such as crystal oscillators supported by bump) 13. The airtight sealing is performed by bonding the cover 1 and the ceramic frame 14 with a glass bonding layer 5 formed by melting and resolidifying a glass material. At this time, if the lid 1 and the ceramic frame 14 are made of the same ceramic mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02H01L23/10H01L21/52
CPCH01L2924/16195H01L23/02H01L21/52H01L23/10H01L2223/00
Inventor 横山绅一郎石尾雅昭
Owner HITACHI METALS LTD
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