Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Spice model based on SiC Schottky diode and its construction method

A technology of Schottky diode and construction method, which is applied in the field of Spice model and its construction based on silicon carbide Schottky diode, can solve system stability problems, interference, electromagnetic oscillation of output current and voltage, etc., and achieve accurate evaluation of dynamic performance effect

Active Publication Date: 2019-07-02
TSINGHUA UNIV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the highly doped epitaxial layer concentration, the depletion layer capacitance of SiC Schottky diodes is generally greater than that of Si-based PINs.
When a SiC Schottky diode is used in a chopper circuit, it will cause electromagnetic oscillation of the output current and voltage, causing system stability problems, such as electromagnetic interference and additional energy loss

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Spice model based on SiC Schottky diode and its construction method
  • Spice model based on SiC Schottky diode and its construction method
  • Spice model based on SiC Schottky diode and its construction method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0034] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and Simplified descriptions, rather than indicating or implying that the device or element refe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a silicon carbide Schottky diode-based Spice model and a construction method thereof. The model comprises a voltage-controlled capacitor, a voltage-controlled resistor, a voltage-controlled body resistor, and a contact resistor, wherein the voltage-controlled capacitor is used for indicating the depletion layer capacitance of the silicon carbide Schottky diode; the voltage-controlled resistor is connected with the voltage-controlled capacitor in parallel and used for indicating the depletion layer current of the silicon carbide Schottky diode; the voltage-controlled body resistor is in series connection with parallel connection nodes of the voltage-controlled capacitor and the voltage-controlled resistor, and used for indicating the body resistance of the silicon carbide Schottky diode; the contact resistor is connected with the voltage-controlled body resistor in series. The silicon carbide Schottky diode-based Spice model disclosed by the invention has the advantage that the obtained diode dynamic curve is well matched with the experimental data. The model can be used for evaluating dynamic performance of the diode accurately and also used for guiding design and application of the silicon carbide Schottky diode.

Description

technical field [0001] The invention relates to the technical field of semiconductors, and specifically designs a Spice model based on a silicon carbide Schottky diode and a construction method thereof. Background technique [0002] In power system applications, SiC Schottky diodes have higher switching speed and lower switching losses than Si-based PINs. However, due to the highly doped epitaxial layer concentration, the depletion layer capacitance of SiC Schottky diodes is generally larger than that of Si-based PINs. When a SiC Schottky diode is used in a chopper circuit, it will cause electromagnetic oscillation of the output current and voltage, causing system stability problems, such as electromagnetic interference and additional energy loss. The main reason for the oscillation is caused by the RLC second-order network composed of the depletion layer capacitance and depletion layer resistance of the Schottky diode, the parasitic stray inductance in the circuit, and the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
CPCG06F30/367
Inventor 岳瑞峰周新田王燕
Owner TSINGHUA UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products