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Preparation method of silicone rubber pad

A technology of silicone rubber and compounded rubber, applied in the field of thermally conductive polymer composite materials, can solve the problems of increasing production costs, failing to meet the requirements of thermal conductivity, and graphene orientation, etc., to enhance surface viscosity, speed up vulcanization rate, improve The effect of thermal conductivity

Active Publication Date: 2016-04-20
DEYANG CARBONENE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent uses a mixture of expanded graphite and other carbon materials as a filler to improve the thermal conductivity of the silicone rubber composite material. Although this method can increase the thermal conductivity of the silicone rubber composite material to 4W / m·K, it still cannot meet the high power requirements. Electronic equipment requires thermal conductivity of thermal gap filler materials, and its preparation process is very complicated, which is not conducive to industrial production
[0006] Another example is that the prior art with the Chinese patent number "201410554466.6" disclosed a graphene-containing silicone rubber heat-conducting composite material and its preparation method on February 4, 2015, although the heat-conducting silicone rubber material prepared by this method can reach The thermal conductivity of 4.98W / m K, but its pretreatment of the filler increases its production cost, and more importantly, it also fails to align graphene, which fails to reflect the ultra-high thermal conductivity of graphene itself. Advantages in silicone rubber

Method used

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  • Preparation method of silicone rubber pad

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Experimental program
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Effect test

Embodiment 1

[0039] A preparation method for a silicone rubber pad, comprising the following steps:

[0040] (1) Preparation of nano-carbon-silicone rubber mixture: Add 100 parts by weight of silicone rubber into a kneader, then add 100-400 parts by weight of nano-carbon material, and knead evenly to obtain a nano-carbon-silicone rubber mixture.

[0041] (2) Preparation of rubber compound: first add the nano-carbon-silicone rubber mixture into the open mill, and then add 10-300 parts by weight of inorganic heat-conducting powder, 1-10 parts by weight of catalyst and 1-10 parts by weight The mixture composed of dimethyl silicone oil and hydrogen-containing silicone oil is kneaded for 10-60 minutes, and the mixed rubber can be obtained after the kneading is completed.

[0042] (3) Put the mixed rubber into a mold, and then use a physical method to orient the mixed rubber to obtain a sample pad in which nano-carbon materials are oriented in silicone rubber; the mold is preferably a square mol...

Embodiment 2

[0051] A preparation method for a silicone rubber pad, comprising the following steps:

[0052] (1) Preparation of nano-carbon-silicone rubber mixture: Add 100g of raw silicone rubber to the kneader, and then add 100g of nano-carbon material, which is a mixture of graphene and flake graphite, and knead evenly to obtain Nano carbon-silicone rubber mixture.

[0053] (2) Preparation of compound rubber: firstly add the nano-carbon-silicone rubber mixture into the open mill for milling, and after 5 minutes of milling, add 10g of metal aluminum powder, 1g of tert-butyl peroxybenzoate and 1g of The mixture composed of simethicone oil and hydrogen-containing silicone oil is kneaded for 10 minutes, and the mixed rubber can be obtained after kneading is completed.

[0054] Wherein, simethicone oil with a viscosity of 500 mPa·s is added to the tert-butyl peroxybenzoate, and the mass percentage of tert-butyl peroxybenzoate to simethicone oil is 1:10. In the mixture composed of simethico...

Embodiment 3

[0058] A preparation method for a silicone rubber pad, comprising the following steps:

[0059] (1) Preparation of nano-carbon-silicone rubber mixture: Add 100g of silicone rubber raw rubber into the kneader, and then add 400g of nano-carbon material, which is a mixture of graphene and carbon nanotubes, and knead evenly A nano-carbon-silicone rubber mixture is obtained.

[0060] (2) Preparation of compound rubber: firstly, add the nano-carbon-silicone rubber mixture into the open mill for kneading. After 20 minutes of kneading, add 300g of metal aluminum powder, 10g of tert-butyl peroxybenzoate and 10g of The mixture composed of simethicone oil and hydrogen-containing silicone oil is kneaded for 60 minutes, and the mixed rubber can be obtained after kneading is completed.

[0061] Wherein, simethicone oil with a viscosity of 5000 mPa·s is added to the tert-butyl peroxybenzoate, and the mass percentage of tert-butyl peroxybenzoate and simethicone oil is 10:100. In the mixture...

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Abstract

The invention discloses a preparation method of a silicone rubber pad. The preparation method includes the following steps that 1, a nanocarbon material is added to silicone rubber, and after uniform kneading is conducted, a nanocarbon-silicone rubber mixture is obtained; 2, inorganic thermal conductivity power, a catalyst and a mixture composed of simethicone and hydrogen containing silicone oil are added to the nanocarbon-silicone rubber mixture, and rubber compound is obtained after open milling is conducted; 3, physical orientation is adopted for the rubber compound, and a sample pad with the nanocarbon material arranged in the silicone rubber in an oriented mode is obtained; 4, the sample pad is vulcanized, and the finished silicone rubber pad is obtained. By means of the preparation method, nanocarbon can be arranged in the silicone rubber in an oriented mode, a regular nanocarbon oriented thermal conductivity network structure is formed, and thus a product with an ultrahigh thermal conductivity coefficient is obtained.

Description

technical field [0001] The invention relates to the field of heat-conducting polymer composite materials, in particular to a method for preparing a silicon rubber pad with ultra-high thermal conductivity. Background technique [0002] With the rapid development of microelectronic integration technology and high-density printed board assembly technology, today's microelectronic equipment is gradually developing towards miniaturization and convenience. Driven by high power, the working thermal environment of semiconductors moves rapidly to high temperature, which requires that the heat generated by semiconductors can be conducted at high speed to ensure the normal operation of electronic equipment. With the development of electronic equipment in the direction of high power and miniaturization, the requirements for the thermal conductivity of thermally conductive interstitial materials are getting higher and higher. It can even be said that the thermal conductivity of thermally...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/07C08K13/04C08K7/06C08K3/04C08K5/14C08K3/34C08K3/38C08K7/24
CPCC08K2201/011C08K2201/014C08L83/04C08L2205/03C08L2205/035C08K13/02C08K3/04C08K5/14C08K2003/0812C08K13/04C08K7/24C08K2003/085C08K7/06C08K3/34C08K2003/385
Inventor 姚林何洪泉尹天平杨桂英高华
Owner DEYANG CARBONENE TECH
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