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Ingot cutting device

A cutting device and crystal ingot technology, which is applied to fine working devices, working accessories, stone processing equipment, etc., can solve problems such as affecting the quality of sliced ​​wafers and weakening the cutting force of wire saws.

Inactive Publication Date: 2017-05-24
MOTECH INDUSTRIES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the bow becomes larger due to the downward pressure of the ingot, the cutting force of the wire saw is weakened and obviously insufficient, thus affecting the quality of slices (such as wafers)

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0030] Please refer to Figure 1 to Figure 3 , Which respectively show schematic diagrams of the ingot cutting device 100 according to an embodiment of the present invention. The ingot cutting device 100 includes a first main roller 110, a second main roller 120, a wire saw 130, and two auxiliary rollers 140 / 150 (ie, a first auxiliary roller 140 and a second auxiliary roller 150). The first main roller 110 and the second main roller 120 are driven to rotate by a motor system (not shown in the figure), and the wire saw 130 is driven by the first main roller 110 and the second main roller 120. The first auxiliary roller 140 and the second auxiliary roller 150 are driven by the wire saw 130. The auxiliary roller 140 / 150 is located between the first main roller 110 and the second main roller 120, and the auxiliary roller 140 / 150 is not connected to the motor system, but is driven by the wire saw 130 to rotate. For the convenience of description, the auxiliary rollers 140 / 150 mentio...

no. 2 example

[0042] Please refer to Figure 5 and Image 6 , Which shows a schematic diagram of a crystal ingot cutting device 200 according to an embodiment of the present invention. The ingot cutting device 100 includes a pair of first main rollers 210, a pair of second main rollers 220, a wire saw 230, and two auxiliary rollers 240 (ie, two first auxiliary rollers). Each first main roller 110 and each second main roller 120 are driven to rotate by a motor system, and the wire saw 230 is driven by the first main roller 210 and the second main roller 220 and moves back and forth in a high-speed loop. Each auxiliary roller 240 is located between the first main roller 210 and the second main roller 220, and each is driven by the wire saw 230 to rotate. Although this embodiment takes four main rollers 210 / 220, a wire saw 230, and two auxiliary rollers 240 as an example, the method of cutting the ingot is similar to the first embodiment, and the difference is that two ingots 20 can be simultan...

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Abstract

A crystal ingot cutting device includes a first main roller, a second main roller, a wire saw and a first auxiliary roller. The first main roller and the second main roller are driven by a motor system to rotate. The wire saw is driven by the first main roller and the second main roller. The first auxiliary roller is located between the first main roller and the second main roller, and one side of the first auxiliary roller supports the wire saw in a horizontal direction. The first auxiliary roller is located at a first vertical position before a crystal ingot to be cut contacts with the wire saw, and the wire saw is limited by a groove on the first auxiliary roller in the horizontal direction. After the crystal ingot to be cut contacts with the wire saw, the first auxiliary roller moves to a second vertical position due to driving of the wire saw, and the first vertical position is higher than the second vertical position.

Description

Technical field [0001] The invention relates to a crystal ingot cutting device, and in particular to a crystal ingot cutting device with auxiliary rollers and a method thereof. Background technique [0002] The ingot cutting device mainly uses a wire saw to cut the ingot to cut the ingot into multiple thin wafers. The wire saw is wound multiple times on two rollers arranged at appropriate intervals to achieve double-wire wire saw cutting. In the process of cutting the crystal ingot, the wire saw is subjected to the downward pressure of the crystal ingot to offset the cutting force of the wire saw, making the wire The phenomenon of saw bending is called bowsize. When the bow shape becomes larger due to the downward pressure of the crystal ingot, the cutting force of the wire saw is weakened and is obviously insufficient, thus affecting the quality of the slice (for example, wafer). Therefore, how to reduce the bow shape and increase the cutting force of the wire saw to improve t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D7/00
Inventor 叶宸夆杨尚伟
Owner MOTECH INDUSTRIES
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