A kind of unsealing method of LED encapsulation structure

Abstract

The present invention discloses an unpacking method for an LED packaging structure. The LED packaging structure comprises a bracket main body, a bracket cup bowl positioned on the bracket main body, an LED chip positioned in the bracket cup bowl, an external pin electrically connected with the LED chip through a lead, and plastic package materials filled in the bracket cup bowl and covering the bracket cup bowl. The unpacking method is characterized by comprising: S1, stripping the plastic package material outside the bracket cup bowl by adopting a physical stripping method to enable the bracket main body, the bracket cup bowl and the LED chip to be separated from the external pin; and S2, dissolving the plastic package material in the bracket cup bowl and the residual plastic package material outside the bracket cup bowl by adopting a wet stripping method until all the plastic package materials are dissolved completely. According to the unpacking method disclosed by the present invention, by adopting the physical stripping method and the wet stripping method to unpack the LED packaging structure, unpacking time of the LED packaging structure is greatly shortened, the unpacking efficiency is improved, and process cost is reduced; and damage to components such as the LED chip and the like during unpacking is small, thereby ensuring the accuracy of subsequent failure analysis.

Description

technical field [0001] The invention relates to the technical field of semiconductor light emitting devices, in particular to an unsealing method for an LED packaging structure. Background technique [0002] A light-emitting diode (Light-Emitting Diode, LED) is a semiconductor electronic component that can emit light. This electronic component appeared as early as 1962. In the early days, it could only emit red light with low luminosity. Later, other monochromatic light versions were developed. Today, the light that can be emitted has covered visible light, infrared rays and ultraviolet rays, and the luminosity has also increased to a considerable extent. of luminosity. And the use is also used as indicator lights, display panels, etc. from the beginning; with the continuous advancement of technology, light-emitting diodes have been widely used in displays, TV lighting decoration and lighting. [0003] The LED packaging structure will fail due to various reasons, including...

AI Technical Summary

Problems solved by technology

Usually, the epoxy resin of the packaging structure is cylindrical, with a diameter of 3mm~10mm and a height of 3~10mm. It takes a long time to completely dissolve the entire epoxy resin, usually 1 hour to 4 hours, and the unsealing efficiency is low.

In addition, since the thickness of the epoxy resin is different at different positions of the LED package structure, all the epoxy resin needs to be dissolved when unpacking, which will cause some places where the thickness of the epoxy resin is thinner to be longer after the epoxy resin is dissolved. Soaked in the solution for a long time, the exposed electronic devices are easily damaged, which will affect the subsequent failure analysis

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