Cooling chip module

Abstract

The invention discloses a cooling chip module and belongs to the field of structural design of cooling chip modules. According to the cooling chip module, an upper cooling chip and a lower cooling chip which adopt completely the same structure are designed, so that the problem that in the prior art, the cooling chip module production cost is relatively high because an upper cooling chip and a lower cooling chip are of different structures is solved, the upper cooling chip and the lower cooling chip can be manufactured only by one die and one production line, accordingly, the cost in producing the cooling chip module is greatly lowered, and further, the manufacturing cost is lowered for manufacturers.

Description

technical field [0001] The invention relates to the structural design field of cooling chips, in particular to a cooling chip component. Background technique [0002] A cooler is a type of heat exchange device used to cool a fluid. Usually water or air is used as a coolant to remove heat. A laminated plate cooler is a type of cooler, which is a device for exchanging heat between a high-temperature fluid and a low-temperature fluid through laminated plates. Due to the advantages of compact structure, light weight and strong adaptability, the laminated cooler is widely used in various industries. [0003] Plate stacked coolers usually include end plates and multiple pairs of cooling chips stacked between the end plates. The outer peripheral flanges of each pair of cooling chips are joined to each other during brazing, so that the high-temperature fluid flowing through the high-temperature fluid The chamber and the low temperature fluid chamber through which the low temperat...

AI Technical Summary

Problems solved by technology

[0005] In view of the above existing problems, the present invention provides a cooling chip assembly to overcome the high cost of producing the cooling chip assembly due to the different structures of the upper cooling chip and the lower cooling chip in the prior art, so that only one mold needs to be opened, and the The upper cooling chip and the lower cooling chip can be manufactured, and only one production line is needed, which greatly reduces the production cost of cooling chip components, and further reduces the manufacturer's manufacturing cost

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