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Transfer tape

A technology without substrates and tapes, applied in the direction of adhesives, natural rubber adhesives, film/sheet adhesives, etc., can solve problems such as damage to electronic devices such as batteries, etc., to achieve convenient operation, simple synthesis, and good adhesion. the effect of strength

Active Publication Date: 2016-03-16
NINGBO KELAIEN NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using this fixing method has extremely high adhesive strength, but at the same time, when there is a problem with electronic products such as mobile phones or tablets and needs to be repaired, the battery pack can only be removed by destructive methods such as prying, which is very easy to damage electronic devices such as batteries

Method used

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  • Transfer tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The base material-free tape of this embodiment comprises an adhesive layer with a thickness of 150 μm and a coated double-sided release paper layer, wherein the ratio of the two-sided release force of the double-sided release paper layer is 1:3, and the adhesive layer and the release paper layer The side with the higher release force of the paper layer is bonded. The raw materials for the preparation of the adhesive layer include the following components in parts by weight: 80 parts of styrene-butadiene rubber, 80 parts of terpene resin, 40101.0 parts of naphthenic oil, 1.0 part of dioctyl phthalate (DOP), 2,2' - 4.0 parts of methylenebis(4-methyl-6-tert-butylphenol), 4.8 parts of color paste (HolcoflexWhite216.2867).

[0026] The preparation method of the adhesive layer is as follows:

[0027] (1) Dissolving at least one of the rubber elastic body in toluene, ethyl acetate, butanone solvent, the solid content of the rubber solution made is 50%;

[0028] (2) dissolvin...

Embodiment 2

[0032] The non-substrate adhesive tape of this embodiment includes an adhesive layer with a thickness of 150 μm and a coated double-sided release paper layer, wherein the ratio of the release force on both sides of the double-sided release paper layer is 1:3. The raw materials for the preparation of the adhesive layer include the following components in parts by weight: 80 parts of styrene-butadiene rubber, 100 parts of terpene resin, 1.0 parts of naphthenic oil, 1.0 part of dioctyl phthalate (DOP), 2,2' - 4.0 parts of methylenebis(4-methyl-6-tert-butylphenol), 4.8 parts of color paste (HolcoflexWhite216.2867).

[0033] The preparation method and coating process of the adhesive layer are the same as in Example 1.

Embodiment 3

[0035] The non-substrate adhesive tape of this embodiment includes an adhesive layer with a thickness of 150 μm and a coated double-sided release paper layer, wherein the ratio of the release force on both sides of the double-sided release paper layer is 1:3. The raw materials for the preparation of the adhesive layer include the following components in parts by weight: 80 parts of styrene-butadiene rubber, 80 parts of terpene resin, 1.0 part of dioctyl phthalate (DOP), 2,2'-methylene bis( 4-methyl-6-tert-butylphenol) 4.0 parts, color paste (HolcoflexWhite216.2867) 4.8 parts.

[0036] The preparation method and coating process of the adhesive layer are the same as in Example 1.

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Abstract

The invention provides a transfer tape which comprises an adhesive layer with the thickness of 80-800 [mu]m, wherein raw materials for preparation of the adhesive layer comprises the following components in parts by weight: 40-50 parts of rubber elastomer, 50-60 parts of tackifying resin, 0-5 parts of a softening agent, 0-5 parts of a plasticizing agent, 1-10 parts of an antioxygen and 0-5 parts of color paste. The transfer tape has the characteristics of being large in sticking strength and long in fixing of the common double-sided adhesive tape, and can be moved only by being pulled out by 0-60 degree when an electronic product is disassembled in maintenance, and so that not only damage to electronic devices of battery and the like in maintenance is avoided, but also great convenience is brought to maintenance personnel.

Description

technical field [0001] The invention relates to the field of electronic equipment auxiliary parts, in particular to a substrate-free adhesive tape. Background technique [0002] With the development of society, electronic products such as mobile phones and tablets generally adopt an all-in-one structure with a built-in battery pack, such as the Apple series mobile phones. The battery pack just needs to be fixed in the mobile phone housing like this, and double-sided adhesive tape is widely used on the market to stick the battery pack in the mobile phone housing. Using this fixing method has extremely high adhesive strength, but at the same time, when there is a problem with electronic products such as mobile phones or tablets and needs to be repaired, the battery pack can only be removed by destructive methods such as prying, which is very easy to damage electronic devices such as batteries. Contents of the invention [0003] The technical problem to be solved by the pres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J109/06C09J145/00C09J191/00C09J11/06C09J153/02C09J161/06C09J107/00C09J193/04C09J109/02C09J157/02C09J191/06
Inventor 吴卓慧许梓晶
Owner NINGBO KELAIEN NEW MATERIAL TECH CO LTD
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