A detection method of hydraulic pressure, buoyancy and floating distance

A detection method and pressure technology, which is applied in the field of precision polishing, can solve the problems that the surface quality of the workpiece is difficult to break through, there is no hydraulic pressure detection technology and polishing gap detection technology, and the working conditions and processing parameters cannot be guaranteed, so as to reduce the detection error. , to ensure the effect of accuracy

Active Publication Date: 2017-11-07
郎溪品旭科技发展有限公司
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Problems solved by technology

[0003] The development trend of non-contact polishing at this stage is higher precision, higher efficiency, and integration of processing and inspection. However, common non-contact polishing, such as float polishing and dynamic pressure float-off polishing, do not have complete hydraulic Pressure detection technology and polishing gap detection technology, the processing status of the workpiece is difficult to know, reliable working conditions and processing parameters cannot be guaranteed, so the surface quality of the processed workpiece is difficult to break through

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  • A detection method of hydraulic pressure, buoyancy and floating distance
  • A detection method of hydraulic pressure, buoyancy and floating distance
  • A detection method of hydraulic pressure, buoyancy and floating distance

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with accompanying drawing:

[0021] The force detection is realized by the silicon piezoresistive pressure sensor 8 and the piezoelectric load cell 16, which have high sensitivity, small zero drift, good repeatability and small structure. The four silicon piezoresistive pressure sensors 8 evenly distributed on the bottom of the container adopt an embedded structure, which can meet the requirements of force measurement under a small gap. The piezoelectric load cell 16 is installed at one end of the spline shaft to detect the buoyancy force on the polishing disc; the distance detection consists of three embedded inductive sensors 9 and a grating ruler. The inductive sensor distributed at the bottom of the container has a detection distance as small as 0-1mm and a working frequency of up to kilohertz, which can meet the detection requirements of the polishing gap. The reading head of the grating ruler is...

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Abstract

The invention provides a detection method for hydrodynamic pressure, buoyancy and upward-floating distance. Hydrodynamic pressure polishing equipment for the method comprises a polishing disc, a container, a ball spline shaft, a movable plate and a side plate. The detection method comprises the steps that a piezoresistive silicon pressure sensor used for hydrodynamic pressure measurement is fixed to the bottom of the container; a piezoelectric force measuring sensor used for buoyancy detection is installed above the ball spline shaft; an inductance type sensor used for detecting the gap distance is fixed to the bottom of the container; and a grating reading head used for detecting the floating distance is arranged on the movable plate. According to the detection method, the micron-grade gap is small, and both pressure detection and distance detection are achieved; the upward-floating amount detection of the polishing disc rotating at a highs speed is converted into the upward-floating amount detection of the movable plate, and detection errors caused by unflatness of the surface of the polishing disc are reduced; the hydrodynamic pressure detection, the buoyancy detection, the gap distance and floating distance detection are achieved, comparison can be conducted through fitting experiment results, and the experiment precision is guaranteed.

Description

technical field [0001] The invention relates to the technical field of precision polishing, and more specifically, to a detection method for hydraulic pressure, buoyancy and floating distance. Background technique [0002] In recent years, with the vigorous development of the fields of optics and microelectronics and related technologies, the requirements for the surface quality of the required materials are getting higher and higher, and the requirements for the roughness of the component surface are more stringent. The non-contact polishing method emerged as the times require, and it is widely used in the preparation of ultra-smooth surfaces, that is, the preparation of surfaces with a roughness root mean square value less than 1 nm, high surface accuracy and low surface waviness. [0003] The development trend of non-contact polishing at this stage is higher precision, higher efficiency, and integration of processing and inspection. However, common non-contact polishing, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B49/12B24B49/16
CPCB24B49/12B24B49/16
Inventor 蔡东海文东辉王扬渝孙白冰
Owner 郎溪品旭科技发展有限公司
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