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A substrate for flexible optoelectronic devices and its preparation method

A technology of optoelectronic devices and substrates, which is applied in the fields of electrical solid devices, semiconductor/solid device manufacturing, electrical components, etc., and can solve the problem of poor bonding between flexible substrates and conductive layers, insufficient flexibility of flexible substrates, and poor water and oxygen barrier capabilities and other issues, to achieve the effect of improving light transmittance, improving water and oxygen barrier ability, and improving performance

Inactive Publication Date: 2018-12-07
广州竞择微电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a substrate for flexible optoelectronic devices and a preparation method thereof in view of the above disadvantages, which solves the problem of insufficient flexibility of the existing flexible substrate, poor water and oxygen barrier ability, poor bonding force between the flexible substrate and the conductive layer, and poor permeability. The problem of low light rate

Method used

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  • A substrate for flexible optoelectronic devices and its preparation method
  • A substrate for flexible optoelectronic devices and its preparation method

Examples

Experimental program
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Effect test

Embodiment 1

[0043] Such as figure 1 In the substrate structure shown, the flexible substrate 2 is a polyimide film doped with a mass ratio of 0.2% cationic UV-sensitive glue and 10% aloe vera gel, and the conductive layer 1 is graphene.

[0044] The preparation method is as follows:

[0045] ① First clean the rigid substrate with a surface roughness less than 1 nm, then use detergent, acetone, deionized water, and isopropanol to perform ultrasonic cleaning, and then dry it with dry nitrogen;

[0046] ② Prepare a mixed film of polyimide, cationic UV-sensitive glue and aloe gel by spin coating on a rigid substrate, with a film thickness of 5 μm. The raw material of the cationic UV-sensitive glue includes the following components:

[0047] Epoxy resin or modified epoxy resin 85 %

[0048] Thinner 10 %

[0049] Cationic photoinitiator 5 %;

[0050] ③ In ② surface spraying method, the graphene aqueous dispersion is prepared as a conductive layer, the height is 20 cm, the spraying pressure ...

Embodiment 2

[0056] Such as figure 1 In the substrate structure shown, the flexible substrate 2 is a polyimide film doped with a mass ratio of 0.5% cationic UV-sensitive glue and 15% aloe vera gel, and the conductive layer 1 is carbon nanotubes.

[0057] The preparation method is as follows:

[0058] ① First clean the rigid substrate with a surface roughness less than 1 nm, then use detergent, acetone, deionized water, and isopropanol to perform ultrasonic cleaning, and then dry it with dry nitrogen;

[0059] ② Prepare a mixed film of polyimide, cationic UV-sensitive glue and aloe gel by spin coating on a rigid substrate, with a film thickness of 20 μm. The cationic UV-sensitive glue raw material includes the following components:

[0060] Epoxy resin or modified epoxy resin 87 %

[0061] Thinner 9 %

[0062] Cationic photoinitiator 4 %;

[0063] ③ In ② surface spraying method, the carbon nanotube aqueous dispersion was prepared as a conductive layer, with a height of 20 cm, a spraying...

Embodiment 3

[0069] Such as figure 1 In the substrate structure shown, the flexible substrate 2 is a polystyrene film doped with a mass ratio of 2% cationic UV-sensitive glue and 23% aloe vera gel, and the conductive layer 1 is silver nanowires.

[0070] The preparation method is as follows:

[0071] ① First clean the rigid substrate with a surface roughness less than 1 nm, then use detergent, acetone, deionized water, and isopropanol to perform ultrasonic cleaning, and then dry it with dry nitrogen;

[0072] ② Prepare a mixed film of polystyrene, cationic UV-sensitive glue and aloe gel by spin coating on a rigid substrate, the film thickness is 60 μm, and the cationic UV-sensitive glue raw material includes the following components:

[0073] Epoxy resin or modified epoxy resin 89 %

[0074] Thinner 8 %

[0075] Cationic photoinitiator 3 %;

[0076] ③ On the surface of ②, the silver nanowire isopropanol dispersion was used to prepare a conductive layer with a height of 20 cm, a sprayin...

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Abstract

The invention discloses a flexible optoelectronic device substrate and a preparation method thereof, comprising a flexible substrate and a conductive layer, characterized in that the flexible substrate is a polymer film, and the polymer film is doped with aloe gel and cations Type UV-sensitive glue, the cationic UV-sensitive glue raw material includes the following components: epoxy resin or modified epoxy resin, diluent and cationic photoinitiator. The invention not only solves the problem of low flexibility of the polymer substrate and the problem of low transmittance of the substrate through the cross-linking effect of the ultraviolet sensitive glue, but at the same time, adding an appropriate amount of aloe vera glue can not only increase the flexibility of the substrate , can also improve the barrier ability of the substrate to water and oxygen, and the substrate can be widely used in the preparation of green and environmentally friendly flexible optoelectronic devices.

Description

technical field [0001] The invention relates to the field of organic optoelectronics, in particular to a substrate for a flexible optoelectronic device and a preparation method thereof. Background technique [0002] Flexible electronics and flexible optoelectronics technology is the most active research direction in the field of electronic information in the past 10 years, and it is also an important direction for the development of the electronic information industry. Flexible electronic products with ultra-light, bendable, rollable and even foldable properties, including flexible liquid crystal displays, flexible organic electroluminescent displays, flexible organic solar cells, etc., have gradually developed into the most promising high-tech industries. However, there are still some problems to be solved in this field: 1. The substrates used in flexible electronics and flexible optoelectronic devices need to meet people’s requirements for portability and lightness; Requi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/54H01L51/56C08L79/08C08L63/00C08L89/00C08J5/18
CPCC08J5/18C08L79/08C08L2203/16C08L2205/03C08J2379/08H10K85/00H10K50/80H10K71/00C08L63/00C08L89/00
Inventor 于军胜陈珉
Owner 广州竞择微电子技术有限公司
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