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Preparation method of nanoscale micro structure

A technology of nanoscale microstructure and carbon nanotube structure, which is applied in the field of preparation of nanoscale microstructures, can solve the problems of long time, complicated process, and difficulty in achieving nanoscale dimensions, and achieves simple preparation method and easy industrialization. , the effect of high efficiency

Active Publication Date: 2016-02-17
TSINGHUA UNIV +1
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  • Application Information

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Problems solved by technology

In these methods, the patterning of the mask layer requires more complicated steps. The above-mentioned methods all require large-scale equipment and instruments, the process is more complicated, the time is longer, and the size is difficult to achieve nanoscale dimensions.

Method used

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  • Preparation method of nanoscale micro structure
  • Preparation method of nanoscale micro structure
  • Preparation method of nanoscale micro structure

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Embodiment Construction

[0019] Various embodiments of the nanoscale microstructure and its preparation method will be further described in detail below in conjunction with the accompanying drawings.

[0020] see figure 1 as well as figure 2 , the first embodiment of the present invention provides a method for preparing a nanoscale microstructure, which includes the following steps:

[0021] Step S10, providing a carbon nanotube structure 110, the carbon nanotube structure 110 comprising a plurality of carbon nanotubes arranged in an orderly manner;

[0022] Step S20, setting a prefabricated layer 120 on the surface of the carbon nanotube structure 110, so that the thickness of the prefabricated layer 120 on the surface of each carbon nanotube is 3 nanometers to 50 nanometers, so as to obtain a carbon nanotube composite structure 130;

[0023] Step S30, disposing the carbon nanotube composite structure 130 on the surface of a substrate 140 to form a mask layer 150, the mask layer has a plurality of...

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Abstract

The invention relates to a preparation method of a nanoscale micro structure. The preparation method comprises includes the following steps that: a carbon nanotube structure is provided, wherein the carbon nanotube structure includes a plurality of orderly-arranged carbon nanotubes; the carbon nanotube structure is suspended, and a prefabricated layer is arranged on the surface of the carbon nanotube structure, and the thickness of the prefabricated layer on the surface of each carbon nanotube ranges from 3 nanometers to 50 nanometers, and therefore, a carbon nanotube composite structure can be formed; the carbon nanotube composite structure is arranged on the surface of a substrate so as to form a mask layer, and a plurality of micropores are formed in the mask layer, and a part of the surface of the substrate is exposed; and the substrate is subjected to dry etching, so that a micro structure can be formed on the surface of the substrate.

Description

technical field [0001] The invention relates to a method for preparing a microstructure, in particular to a method for preparing a nanoscale microstructure. Background technique [0002] In the prior art, when making various semiconductor devices, it is often necessary to make microstructures with tens of nanometers to hundreds of nanometers. Fabrication methods with the above-mentioned microstructure mainly include electron beam photolithography, plasma etching, and the like. In these methods, the patterning of the mask layer requires more complicated steps. The above methods all require large-scale equipment and instruments, the process is more complicated, the time is longer, and the size is difficult to achieve nanoscale dimensions. Contents of the invention [0003] In view of this, it is indeed necessary to provide a preparation method of the microstructure, which has a simple process. [0004] A method for preparing a nanoscale microstructure, which includes: prov...

Claims

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Application Information

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IPC IPC(8): H01L21/02B82Y40/00B82Y10/00
CPCC23C14/046C23F4/00H01L21/0332H01L21/30621H01L21/3081H01L21/31144H01L21/32136H01L21/32139B81C1/00214B81B2207/056H01B1/04C23C16/045C23C16/042C23C16/45525
Inventor 金元浩李群庆范守善
Owner TSINGHUA UNIV
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