Setter plate applied to low-temperature co-sintering ceramic sintering

Abstract

The invention provides a setter plate applied to low-temperature co-sintering ceramic sintering. The setter plate is characterized in that the setter plate is a quasi flat plate with a cavity structure and utilizes high-temperature ceramic formation; the specific implementation method comprises a conventional multilayer ceramic manufacturing process and a conventional blanking and grinding process; the surface roughness is lower than 1.6, the surface evenness is smaller than 15 microns and the upper-lower flatness is lower than 1 degree; the existing types of low-temperature co-sintering ceramic sintering can be met. The invention has the beneficial effects that the manufacturing cycle of the setter plate is simple and short, the service cycle is long, the setter plate resists corrosion, oxidization and adhesion, is low in cost and does not sinter with low-temperature co-sintering ceramic, and the evenness of the sintered low-temperature co-sintering ceramic is smaller than 1 micron per millimeter and meets a 0.10 mm feeler gauge test; the manufacturing process of the low-temperature co-sintering ceramic is simplified, the package process of the low-temperature co-sintering ceramic is effectively improved, the electrical performance of required devices is optimized, and the setter plate can be widely applied to the low-temperature co-sintering ceramic sintering process.

Description

technical field [0001] The patent of the present invention is a setter plate applied to sintering of low-temperature co-fired ceramics and its realization method. Background technique [0002] Low-temperature co-fired ceramics (LTCC) technology is relatively small in size, light in weight, and high in reliability due to the low-temperature co-fired ceramics used. Metallized conductors have excellent high-frequency and high-speed signal transmission characteristics, and have good compatibility with thin-film multilayer wiring technology Compatibility, simple manufacturing process, mass production, and more and more applications in the field of civilian and military electronic communication devices. [0003] In the actual production process, LTCC components are scrapped due to various factors, including warpage. Therefore, the quality of warpage is an important criterion for clearly judging whether LTCC products are qualified or not, and it is also a key indicator that users ...

AI Technical Summary

Problems solved by technology

Warpage is one of the important factors affecting the installation performance, performance and heat dissipation performance of components. With the increase of substrate size and denser metallization wiring, the warpage value of the actual production substrate fluctuates greatly. Some The product will exceed the indicators specified by the user, so that the product is unqualified

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