hollow door

Abstract

The invention discloses a hollow door, which can reduce heat loss, is beneficial to maintain the ambient temperature, and can meet certain thermal insulation requirements in semiconductor wafer technology. The technical solution is: design a hollow layer for heat insulation among the two panels, so as to insulate the interior of a certain space from the outside. Compared with the traditional technology, the hollow door of the present invention can make the XeF2 etching system or gluing machine and other equipment that need to maintain a certain ambient temperature in the semiconductor wafer process better meet the temperature conditions.

Description

technical field [0001] The invention relates to a door panel device, in particular to a door panel device used in semiconductor wafer manufacturing equipment. Background technique [0002] In the gas cabinet of the XeF2 etching system for semiconductor wafer manufacturing, because the substance XeF2 needs to be in a certain temperature to reach the gasification state, the higher the temperature, the faster the gasification rate will be. Usually the temperature in the gas cabinet is maintained at 45 degrees Celsius or above. The existing equipment adopts a single-layer metal door, and the external temperature is low, which will cause a large amount of temperature loss, making it difficult to maintain the internal temperature, and is more affected by the external environment. [0003] In addition, on the equipment of the gluing machine, the photoresist liquid supply bottle needs a certain temperature to be sufficient. Since the viscosity of the photoresist is relatively high...

AI Technical Summary

Problems solved by technology

The existing equipment adopts a single-layer metal door, and the external temperature is low, which will cause a large amount of temperature loss, making it difficult to maintain the internal temperature, and is more affected by the external environment

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