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hollow door

A hollow, panel technology, used in door leaves, electrical components, circuits, etc., can solve problems such as low temperature, influence, and difficulty in maintaining internal temperature.

Active Publication Date: 2018-07-06
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The existing equipment adopts a single-layer metal door, and the external temperature is low, which will cause a large amount of temperature loss, making it difficult to maintain the internal temperature, and is more affected by the external environment

Method used

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Embodiment Construction

[0013] The above-mentioned features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale, and components with similar related properties or characteristics may have the same or similar reference numerals.

[0014] Figures 1A to 1D The structure of the preferred embodiment of the hollow door of the present invention is shown from different angles of view. See also Figures 1A to 1D , The hollow door of this embodiment includes a first panel 1 , a second panel 2 and a hollow layer 3 sandwiched between the first panel 1 and the second panel 2 . The hollow layer 3 can be filled with air, an inert gas, or an intermediate vacuum, all in order to ensure a good heat insulation effect.

[0015] Preferably, a metal mirror coating is covered on the first panel 1 , and a metal mirror coa...

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Abstract

The invention discloses a hollow door, which can reduce heat loss, is beneficial to maintain the ambient temperature, and can meet certain thermal insulation requirements in semiconductor wafer technology. The technical solution is: design a hollow layer for heat insulation among the two panels, so as to insulate the interior of a certain space from the outside. Compared with the traditional technology, the hollow door of the present invention can make the XeF2 etching system or gluing machine and other equipment that need to maintain a certain ambient temperature in the semiconductor wafer process better meet the temperature conditions.

Description

technical field [0001] The invention relates to a door panel device, in particular to a door panel device used in semiconductor wafer manufacturing equipment. Background technique [0002] In the gas cabinet of the XeF2 etching system for semiconductor wafer manufacturing, because the substance XeF2 needs to be in a certain temperature to reach the gasification state, the higher the temperature, the faster the gasification rate will be. Usually the temperature in the gas cabinet is maintained at 45 degrees Celsius or above. The existing equipment adopts a single-layer metal door, and the external temperature is low, which will cause a large amount of temperature loss, making it difficult to maintain the internal temperature, and is more affected by the external environment. [0003] In addition, on the equipment of the gluing machine, the photoresist liquid supply bottle needs a certain temperature to be sufficient. Since the viscosity of the photoresist is relatively high...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E06B3/70H01L21/67
Inventor 方志友金一诺张怀东王坚王晖
Owner ACM RES SHANGHAI
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