Travel time measurement method based on ultrasonic two-dimensional temperature measurement device

Abstract

Aiming at the requirements for precise measurement of ultrasonic wave travel time, the invention proposes a travel time measurement method based on an ultrasonic two-dimensional temperature measurement device. The method employs four ultrasonic sensors to construct a two-dimensional temperature measurement environment, designs a virtual instrument temperature testing system based on a LabVIEW software platform, and solves an envelope of a collected signal waveform, so as to extract an overall characteristic tendency of the collected signal waveform. The method obtains more accurate travel time through employing a cross-correlation algorithm, calculates a temperature mean value of a travel path according to an ultrasonic wave temperature measurement theory, compares the temperature mean value with an actual measurement value of a temperature instrument, and converts a temperature error into a travel time error. Through theoretical analysis and experiment verification, the travel time precision of the method reaches an ns level.

Description

Technical field [0001] The invention is a temperature measurement method, and relates to a flying time measurement method based on an ultrasonic temperature measurement device. Background technique [0002] The existing temperature measurement methods are mainly divided into two types, one is a contact type and the other is a non-contact type. Contact measurement requires long enough contact to reach thermal equilibrium. This method often has to destroy the thermal equilibrium state of the object to be tested, and is subject to corrosion by the measured medium. Therefore, the structure and performance requirements of the temperature sensing element are strict, and this method is not suitable for temperature measurement in a high temperature environment. The characteristic of non-contact temperature measurement is that it does not contact with the measured object and does not change the temperature distribution of the measured object. This method is superior for temperature measu...

AI Technical Summary

Problems solved by technology

Ultrasonic temperature measurement technology will provide a non-contact, real-time, multi-dimensional temperature measurement method, which overcomes the shortcomings of thermocouples and thermal resistances that are not suitable for microwave environments and slow response speed; it breaks through the optical fiber contact and single-point temperature measurement limitations; avoiding the interference caused by the infrared method being easily affected by light

In recent years, the research on ultrasonic measurement system mainly takes the microcontroller as the core to realize the acquisition of ultrasonic echo signals and related algorithms, and realize the display of ultrasonic measurement data through VB, VC, Matlab and other software platforms, but the complex calculation of signals, echo The waveform display and analysis are relatively weak and less flexible

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