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Phenol-formaldehyde condensation product binding material

A formaldehyde condensate and adhesive material technology, applied in the direction of aldehyde/ketone condensation polymer adhesives, adhesive additives, adhesive types, etc., can solve the problem of phenol-formaldehyde condensate bond loosening, phenol-formaldehyde condensate Adhesive strength is not high

Inactive Publication Date: 2016-02-03
王晓伟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Adhesive compositions are widely used in various industries. In the prior art, phenol-formaldehyde condensate adhesive materials are often used to bond various materials. Because the bonding strength of phenol-formaldehyde condensate is relatively low, those who use it for a long time The phenol-formaldehyde condensate bond appears loose

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A phenol-formaldehyde condensate binding material, which is made of the following raw materials in parts by weight,

[0014] Phenol-formaldehyde condensate 100

[0015] Silicon carbide powder 3

[0016] Amylose 2

[0017] Dextran 0.1

[0018] Graphene oxide fine powder 0.1.

Embodiment 2

[0020] A phenol-formaldehyde condensate binding material, which is made of the following raw materials in parts by weight,

[0021] Phenol-formaldehyde condensate 100

[0022] Silicon carbide powder 4

[0023] Amylose 3

[0024] Dextran 0.2

[0025] Graphene oxide powder 0.2.

Embodiment 3

[0027] A phenol-formaldehyde condensate binding material, which is made of the following raw materials in parts by weight,

[0028] Phenol-formaldehyde condensate 100

[0029] Silicon carbide powder 4

[0030] Amylose 3

[0031] Dextran 0.2

[0032] Graphene oxide powder 0.2.

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PUM

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Abstract

The invention provides a phenol-formaldehyde condensation product binding material. The binding material is prepared by the following raw materials according to a proportion: a phenol-formaldehyde condensation product, silicon carbide micro powder, amylose, glucan and graphene oxide micro powder. The phenol-formaldehyde condensation product has a large adhesion, according to the formula, silicon carbide micro powder and amylase are added as filling materials, and the prepared condensation product has a higher binding performance.

Description

technical field [0001] The invention relates to a tackifying material, in particular to a phenol-formaldehyde condensate bonding material. Background technique [0002] Adhesive compositions are widely used in various industries. In the prior art, phenol-formaldehyde condensate adhesive materials are often used to bond various materials. Because the adhesive strength of phenol-formaldehyde condensate is relatively low, those who use it for a long time The phenol-formaldehyde condensate bond appears loose. Adding silicon carbide micropowder and amylose as filler can change this situation. Contents of the invention [0003] The technical problem to be solved by the present invention is to propose an adhesive-resistant phenol-formaldehyde condensate adhesive material for the deficiencies of the prior art. [0004] A phenol-formaldehyde condensate binding material, which is made of the following raw materials in parts by weight, [0005] Phenol-formaldehyde condensate 100 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/10C09J103/12C09J11/04C09J11/08
Inventor 王晓伟
Owner 王晓伟
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