MEMS device for preventing suspension layer etching damage

Abstract

The invention relates to an MEMS device for preventing suspension layer etching damage, wherein a shallow cavity (4), an electrode (9) and an electrode isolation groove (5) are arranged on the surface of substrate silicon (3), a first oxide layer (6) with a thickness of 1500-5000 angstroms and a second oxide layer (7) with a thickness of 500-1500 angstroms are arranged on the surface of the shallow cavity (4), and a movable structural layer (8) is bonded on SOI silicon wafer top layer silicon (3) of the substrate; and a cap silicon wafer (10) is bonded with the SOI silicon wafer top layer silicon (3) of the substrate through glass frit (11) to achieve wafer level vacuum package. Compared with traditional MEMS devices, the MEMS device provided by the invention has the advantages that, a stepped silicon dioxide layer is used for protecting a lower electrode structure to not only well protect the lower electrode structure from being etched, but also avoid etching back splash damage of the structural layer and guarantee the integrity of the movable structure, the implementation method of the device structure is simple and feasible, and a standard process is convenient to form.

Description

technical field [0001] The invention belongs to the technical field of micro-electronic machinery, and in particular relates to a MEMS structure for preventing etching damage of a suspension structure. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) is an interdisciplinary technology developed on the basis of microelectronics technology. It uses photolithography, etching, film formation, bonding and other micro-processing methods to form electro-mechanical structures. , materials, machinery, physics, chemistry, biology and other fields. MEMS has attracted widespread attention due to its many advantages such as miniaturization, low power consumption, and mass production, and has been widely cited in the fields of automotive electronics, smart terminals, Internet of Things, and biomedicine. [0003] Compared with semiconductor integrated circuits, MEMS devices generally include movable mechanical structures. At present, the MEMS manufacturing process is ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the existing MEMS device in the etching process, the etching ions accumulate on the surface of silicon dioxide, generate a reverse electric field, cause the direction of the etching ions to change, and cause a large impact on the bottom of the movable structure layer. The defect of damage, proposes a kind of MEMS device that prevents suspension layer etching damage, another object of the present invention provides a kind of MEMS device fabrication method that prevents suspension layer etching damage exactly

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