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Semiconductor refrigeration structure of a soda cup

A technology for semiconductors and soda cups, applied in the field of semiconductor refrigeration structures, can solve the problems of unstable material supply, influence on gas production effect, and inability to refrigerate, and achieve the effects of convenient operation, fast production speed, and prevention of dew condensation.

Active Publication Date: 2017-03-15
枣庄龙海自动化设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still some structural defects, which cause unstable material supply, affect the gas production effect, and cannot be refrigerated.

Method used

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  • Semiconductor refrigeration structure of a soda cup
  • Semiconductor refrigeration structure of a soda cup
  • Semiconductor refrigeration structure of a soda cup

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0020] Such as figure 1 , 2 As shown, a semiconductor refrigeration structure of a soda cup includes a cup body 1, a steam-making mechanism 3 and a refrigeration device 2, the upper end of the cup body is connected to the detachable steam-making mechanism 3, and the lower end of the cup body is connected to the refrigeration device 2, The outer casing of the steam-making mechanism 3 is formed by connecting the upper part 36 and the lower part 37, the upper part 36 of the steam-making mechanism 3 can rotate, and the inner cavity of the upper part 36 is provided with a material storage chamber 31 and a metering disc 32, and the steam-making mechanism 3 The inner cavity of the lower part 37 is provided with a discharge tray 34, and the lower part 37 is threadedly connected with the cup body 1. The storage chamber 31 and the metering disc 32 in the upper part 36 of the steam making mechanism 3 are connected with the discharge disc 34 in the lower part 37 by the mandrel 35 in sequ...

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PUM

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Abstract

The invention discloses a semiconductor refrigeration structure of a soda water cup. The wall of the cup is provided with an interlayer of a cold air backflow channel. A refrigeration chamber of a refrigeration device and an airflow chamber of a heat dissipation device of a semiconductor refrigeration plate are communicated with an air inlet and an air outlet of the cold air backflow channel respectively. A fan makes cold airflow of a cold source generated in the refrigeration chamber rotate in the cold air backflow channel in the wall of a cup body. A guide tube communicated with a cup wall exhaust hole is arranged at the bottom of the airflow chamber. A soda water making mechanism is detachably connected with the cup body and forms the soda water cup with the rapid soda water making and cooling functions through the cooperation of a storage bin, a metering panel and a discharging plate. The semiconductor refrigeration structure is high in soda water making speed, good in refrigeration effect, capable of making soda water at any time and providing the soda water for a user instantly, safe and sanitary.

Description

technical field [0001] The invention relates to a beverage container, in particular to a semiconductor refrigeration structure of a soda cup. Background technique [0002] Drinking carbonated beverages in summer has a refreshing feeling, because carbonated beverages contain a lot of carbon dioxide gas, which can take away the heat in the body and play a role in relieving heat and thirst, so they are very popular. Currently commercially available carbonated beverages are filled with carbon dioxide gas under certain conditions to mix the carbon dioxide with the beverage. In order to improve the color, fragrance and prolong the storage time, pigments, additives and preservatives are added to the beverage. If people often drink , is bound to cause certain harm to the body. Simultaneously, the sugar content in the carbonated beverage is high, for the group that likes carbonated beverage but can't eat sugary food, but flinches away. In order to solve this problem, the applicant ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B21/02A47J31/40
Inventor 胡海明
Owner 枣庄龙海自动化设备有限公司
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