Adhesive composition

A pressure-sensitive adhesive, acrylic pressure-sensitive adhesive technology, applied in the direction of adhesive types, ester copolymer adhesives, adhesives, etc., can solve the problems of yield defects, short pot life, etc., to shorten the curing time effect of time

Inactive Publication Date: 2015-10-28
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of the technology, the curing rate of the pressure-sensitive adhesive tape may be accelerated, but additionally, its pot life is short, thereby causing a disadvantage in terms of productivity.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0117] Preparation Example 1. Preparation of acrylic pressure-sensitive adhesive resin A

[0118] In a 2L reactor in which nitrogen is refluxed and equipped with a cooling device to facilitate temperature control, the weight ratio of 84.1:0.9:15 (EHA:N-ma:HEA) is poured into ethylhexyl acrylate (EHA), N- Hydroxymethylacrylamide (N-ma) and Hydroxyethyl Acrylate (HEA). Subsequently, 149.1 parts by weight of ethyl acetate (EAc) was poured therein as a solvent, and purged with nitrogen for 60 minutes to remove oxygen. With the temperature maintained at 67°C, 0.04 parts by weight of azobisisobutyronitrile (AIBN) was poured therein as a reaction initiator, and the mixture was reacted for 3 hours. The reaction product was diluted with ethyl acetate (EAc) to prepare acrylic pressure-sensitive adhesive resin A.

preparation Embodiment 2

[0119] Preparation Example 2. Preparation of acrylic pressure-sensitive adhesive resin B

[0120] In a 2L reactor in which nitrogen is refluxed and equipped with a cooling device to facilitate temperature control, 85 parts by weight of n-ethylhexyl acrylate (EHA) and 15 parts by weight of hydroxyethyl acrylate (HEA) are poured. Subsequently, 149.1 parts by weight of ethyl acetate (EAc) was poured therein as a solvent, and purged with nitrogen for 60 minutes to remove oxygen. With the temperature maintained at 67°C, 0.04 parts by weight of azobisisobutyronitrile (AIBN) was poured therein as a reaction initiator, and the mixture was reacted for 3 hours. The reaction product was diluted with ethyl acetate (EAc) to prepare an acrylic pressure-sensitive adhesive resin B having a solid concentration of 30% and a molecular weight of 700,000.

[0121] Preparation of pressure-sensitive adhesive composition and protective film

Embodiment 1

[0123] The acrylic pressure-sensitive adhesive resin A obtained in Preparation Example 1 was used. With respect to 100 parts by weight of the pressure-sensitive adhesive resin, a crosslinking agent (wherein, hexamethylene diisocyanate and isophorone diisocyanate are each at 8 : 2), 7 parts by weight of acetylacetone and 0.01 parts by weight of K-KAT 5218 (aluminum chelate catalyst, King Industry Company) to prepare a pressure-sensitive adhesive composition.

[0124] The pressure-sensitive adhesive composition was coated on one side of a polyethylene terephthalate (PET) film (thickness: 50 μm), and treated at 120° C. for 2 minutes to form a coating having a thickness of 20 μm. The transparent pressure-sensitive adhesive layer of the cloth film to prepare a protective film.

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Abstract

Provided are a pressure sensitive adhesive composition and uses thereof. According to the pressure sensitive adhesive composition of the present invention, by raising an initial curing rate using a metal chelate compound that does not have tin, an orange peel phenomenon which occurs in a preparation process of a conductive protective film can be improved effectively as well as that its pot life and storage modulus can be adjusted appropriately to increase productivity. Also, according to the pressure sensitive adhesive composition of the present invention, an aging time after a coating process of the pressure sensitive adhesive composition can be shortened, storage stability of a coating liquid can be adjusted appropriately, and thus productivity can be increased and costs can be reduced in preparation of a pressure sensitive adhesive.

Description

Technical field [0001] The invention relates to a pressure-sensitive adhesive composition and its use. Background technique [0002] Pressure-sensitive adhesives have been used for various purposes due to advantages such as ease of application. The pressure-sensitive adhesive may be prepared by using, for example, a pressure-sensitive adhesive resin (such as acrylic copolymer, etc.), and the pressure-sensitive adhesive may be crosslinked by using a crosslinking agent or the like in consideration of cohesion and the like. Mixture resin (for example, see Patent Documents 1 and 2). In order to crosslink the pressure-sensitive adhesive resin, an additional process such as an aging process is required, and this additional process may be a negative factor in terms of yield and the like. [0003] At the same time, a conductive film (for example, an ITO film) laminated on a substrate is generally used as the conductive film. In addition, the conductive film is used as a conductive film ...

Claims

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Application Information

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IPC IPC(8): C09J133/04C09J7/02H01B5/14
Inventor 朴容秀金贤哲李熙济
Owner LG CHEM LTD
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