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Resistance assembly for mobile device and manufacturing method thereof

A technology for moving devices and resistors, which is applied in the direction of resistor manufacturing, adding resistors at the lead-out end, resistors, etc., can solve the problem of increasing the space used by the substrate, and achieve the effect of effective control

Active Publication Date: 2015-10-28
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this circuit design will inevitably increase the space used by the substrate

Method used

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  • Resistance assembly for mobile device and manufacturing method thereof
  • Resistance assembly for mobile device and manufacturing method thereof
  • Resistance assembly for mobile device and manufacturing method thereof

Examples

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Embodiment Construction

[0020] Hereinafter, specific embodiments of a resistance assembly for a mobile device and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention with reference to the accompanying drawings, the same reference numerals will be used to designate any identical or corresponding elements, and redundant descriptions of the same or corresponding elements will not be provided.

[0021] Terms such as 'first' and 'second' may only be used to distinguish one element from other identical or corresponding elements, and the above elements should not be limited by the above terms.

[0022] When an element is described as being "coupled to" another element, it does not only refer to physical, direct contact between these elements, but also includes placing another element between and within said elements. The probability that each element of is in contact with the other ...

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Abstract

A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2014-0050079 filed with the Korean Intellectual Property Office on Apr. 25, 2014, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The invention relates to a resistance assembly for a mobile device and a manufacturing method thereof. Background technique [0003] In various instances where resistors are used in electrical circuits, the circuit is sometimes designed to assist the operation of the circuit by regulating the current flow of electrical power. In this circuit design, if the resistance is damaged by an external impact (e.g. surge, static electricity, etc.) damage. [0004] The idea to prevent this is to design the circuit with multiple resistors or to design the circuit with array type resistors. However, this circuit design will inevitably increase the space used by the substrate. [0005] Specifically, as mobile devices become sma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/01
CPCH01C1/01B32B37/0076B32B37/24B32B2037/243B32B2307/20B32B2457/00H01C17/00H01C17/28H01C1/14H01C7/003H01C13/02H01C17/006
Inventor 李裁勋崔祐溱金荣基
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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