Ferrite slurry used for wet process stacked inductor printing and manufacturing method thereof

Abstract

The invention provides ferrite slurry used for wet process stacked inductor printing and a manufacturing method thereof. The main constituent of the ferrite slurry used for the wet process stacked inductor printing is NiCuZn ferrite, Ni in the main constituent takes up 15mol%-25 mol% when being converted into NiO, copper takes up 8mol%-13mol% when being converted into CuO, Zn takes up 18mol%-25mol% when being converted into ZnO, and the balance iron takes up 46.5mol%-49.5mol% when being converted into Fe<2>O<3>; auxiliary agents comprise a combustion auxiliary agent and an addition agent, and the combustion auxiliary agent is Bi<2>O<3> and / or B<2>O<3> and takes up 1-4wt% of the main constituent; the addition agent is Co<2>O<3> and takes up 0.1-0.5wt% of the main constituent. The manufacturing method of the ferrite slurry used for the wet process stacked inductor printing comprises the steps of material compounding, first ball-milling, secondary ball-milling and baking. By means of the ferrite slurry used for the wet process stacked inductor printing, electric conduction among conductive circuit layers is good.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a ferrite slurry for wet lamination inductive printing and a manufacturing method thereof. Background technique [0002] With the rapid development of science and technology, the market demand for electronic components is increasing year by year, and the market also puts forward higher requirements for the reliability of electronic components. The production and processing of electronic components by lamination has become one of the most important methods, which can produce laminated chip inductors on a large scale. The lamination molding method is divided into wet molding and dry molding; the steps of the traditional wet molding method are: 1. Casting a diaphragm of a certain thickness on the substrate; 2. Printing conductive circuit paste on the diaphragm; 3. The end of the printed circuit is printed with a certain height of conductive paste, which serves as the connection...

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the problem in the prior art that the conductive point paste is not exposed or exposed unevenly during the inductance wet forming process, resulting in poor conduction between the conductive circuit layers, the present invention provides a ferrite slurry and its manufacturing method, so that the conductive circuit layer good electrical conductivity

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