Transparent conductive film and capacitive touch screen comprising same
A technology of transparent conductive film and transparent substrate, applied in the direction of electrical digital data processing, input/output process of data processing, instruments, etc., can solve the problems of poor adhesion of transparent conductive film, poor anti-fouling and anti-skid ability, etc., and achieve good performance , avoid pollution and reduce the effect of producing finished products
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0052] An acrylic resin layer is coated on the surface of the transparent substrate layer 20 , dried and cured to form the fingerprint affinity layer 10 .
[0053] Utilize magnetron sputtering, form the ITO layer 60 on the fingerprint affinity surface of the transparent substrate layer 20, as figure 1 As shown, the ITO layer 60 includes a first amorphous ITO layer 61 , a crystalline ITO layer 62 and a second amorphous ITO layer 63 .
[0054] The first non-crystalline ITO layer 61, the crystalline ITO layer 62 and the second non-crystalline ITO layer 63 of the transparent conductive film are etched by an ink screen printing etching method, and then baked at a temperature of 150 ℃, the time is 60min. The specific structural parameters of the transparent conductive film are shown in Table 1.
Embodiment 2
[0056]The surface of the transparent substrate layer 20 is coated with a hardening solution of the type FZ001 selected from Japan Arakawa Chemical Co., Ltd., dried and solidified to form the fingerprint affinity layer 10 . Then, in the same way, on the surface of the transparent substrate layer 20 away from the above-mentioned fingerprint affinity layer 10, a hardening solution of the type PC13-1082 selected from DIC Corporation of Japan is coated to form the hardening layer 30.
[0057] Using a magnetron sputtering process, a film is coated on the surface of the hardened layer 30 away from the above-mentioned transparent substrate layer 20, and the first optical adjustment layer 40, the second optical adjustment layer, the first amorphous ITO layer 61, and the crystalline ITO layer are sequentially obtained. layer 62 and a second amorphous ITO layer 63, forming figure 2 structure shown.
[0058] The ITO layer 60 of the transparent conductive film was etched by an ink screen...
Embodiment 3
[0060] Adopt the method identical with embodiment 1 to prepare figure 2 For the transparent conductive film shown, the structural parameters of the prepared transparent conductive film are shown in Table 1, wherein the hardening solution for coating the fingerprint affinity layer 10 is the hardening solution of FZ001 from Japan Arakawa Chemical Co., Ltd., and the coating hardening layer 30 The hardening solution used is the PC13-1082 hardening solution from DIC Corporation of Japan, and the specific structural parameters of the transparent conductive film are shown in Table 1.
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com