Fixture for packaging stack array of semiconductor laser

Abstract

The invention provides a fixture for packaging a stack array of a semiconductor laser. The fixture comprises two guide rails fixed on a fixed plate, and at least two toggle pins used for fixing transition heat sinks placed in the middles of the two guide rails, wherein the toggle pins are mounted on tracks of the two guide rails in a one-to-one correspondence manner, and comprise tube bodies; movable screws and ejector pins are mounted at the two ends of the tube bodies respectively; the ejector pins move forward by screwing the screws; and the ejector pins of the two toggle pins in the one-to-one correspondence manner face towards the middles of the two guide rails. The fixture can realize positioning and fixing of the transition heat sinks in a packaging process, and can avoid displacement of the transition heat sinks and chips due to movement in the packaging process.

Description

technical field [0001] The invention relates to a device for packaging a stack of lasers, in particular to a fixture for packaging a stack of semiconductor lasers. Background technique [0002] The semiconductor laser array chip is composed of many semiconductor laser light-emitting units, and these light-emitting units form an array chip (Bar bar) on a chip that has not been cleaved. Then, these array chips are vertically stacked and packaged by a certain method to form a semiconductor laser stack. In this way, multiple array chips are packaged together, and multiple array chips work at the same time to achieve high-power laser output. Semiconductor laser stack packaging is very difficult, because the array chips (bars) of semiconductor lasers are very small, with a thickness of about 0.5 mm, a length of about 10 mm, and a width of about 1 mm. At present, there is no fully automatic equipment that can directly package the stack. Therefore, at present, the packaging o...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a jig for stack packaging of semiconductor lasers that prevents the placement of transitional heat sinks and chips from moving during the packaging process from reducing the packaging accuracy, so as to solve the problems in the prior art

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