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Electronic equipment and air flow accelerating device

A technology of electronic equipment and acceleration device, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of high temperature of electronic devices, heat cannot be conducted in time, affecting electronic devices, etc. The effect of timely conduction and improving heat dissipation efficiency

Active Publication Date: 2015-08-19
LENOVO (BEIJING) CO LTD
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0005] The present application provides an electronic device and an airflow acceleration device, which improves the technical problem in the prior art that the heat generated by the electronic device cannot be conducted in time, resulting in a high temperature of the electronic device and affecting the operation of the electronic device , to achieve the technical effect of improving the heat dissipation efficiency of the electronic equipment

Method used

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  • Electronic equipment and air flow accelerating device
  • Electronic equipment and air flow accelerating device
  • Electronic equipment and air flow accelerating device

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Embodiment 2

[0049] Based on the same inventive concept, the present application also provides an airflow accelerating device 200 . Such as image 3 As shown, it is a schematic cross-sectional view of another preferred embodiment of the airflow accelerating device 200 of the present application. The airflow acceleration device 200 includes a housing 210 , a vibrating piece 220 and an electromagnet 230 .

[0050] see also Figure 4 , at least the first part 211 of the casing 210 is made of memory metal material. Memory metal is also called shape memory alloy. The microstructure of memory metal has two relatively stable states. At high temperature, this alloy can be changed into any shape you want. At lower temperature, the alloy can be stretched, but if it is reheated, it will It will remember its original shape and change back. This material is called memory metal (memory metal). It is mainly nickel-titanium alloy material. In this embodiment, the memory metal material may be a one-...

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Abstract

The invention discloses electronic equipment and an air flow accelerating device. The electronic equipment comprises a housing, an electronic device, a vibration sheet and an electromagnet. The housing comprises a front housing and a rear housing arranged opposite to the front housing. The rear housing is made of a memory metal material. The electronic device is arranged between front housing and the rear housing. The vibration sheet is arranged between electronic device and the rear housing. The vibration sheet comprises a fixed part and a free end. The fixed part is relatively fixed to the front housing. The vibration sheet is made of material capable of being absorbed by a magnetic piece. The electromagnet is arranged between the front housing and the rear housing. When the heat radiated by the electronic device enables the temperature of the rear housing to reach a preset value, the rear housing deforms, the space between the rear housing and the front housing is increased, the electromagnet is power-on, and the free end of the vibration sheet is capable of swinging in the space under the magnetic force of the electromagnet, so that the heat radiation speed is increased.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to an electronic equipment and an airflow accelerating device. Background technique [0002] With the development of science and technology and the progress of society, electronic devices such as computers, mobile phones, and televisions have become an indispensable part of people's lives and work. [0003] In order to ensure that the electronic devices in the electronic equipment can work normally, the electronic equipment is usually provided with heat dissipation elements. Specifically, the electronic equipment includes: an electronic device that emits heat during operation (such as a central processing unit, a heating electronic component, etc.), a heat sink that dissipates the heat, and a conductive element disposed between the electronic device and the heat sink. The conduction element is used to transmit the heat emitted by the electronic device to the heat dissi...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 吴杨华
Owner LENOVO (BEIJING) CO LTD
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