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Detection method of interface morphology of multilayer bonded structure

A detection method, a bonding technology, applied in the processing of the response signal of the detection, the use of sound waves/ultrasonic waves/infrasonic waves to analyze solids, etc.

Active Publication Date: 2017-07-14
BEIJING UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Qiu and other scholars published the article "Ultrasonic beam steering using Neumann boundary condition in multiplysics" in Acta Mechanica Sinica in 2012, Murashov published the article "Identification of areas of absence of adhesive bonding between layers in multilayer structures" in PolymerScience Series in 2014, and Li Mingxuan and other scholars In 2013, the article published in Applied Acoustics "Ultrasonic Detection and Evaluation of Adhesive Interface Properties" and other published articles or published research results only studied rigidly bonded interfaces, weakly bonded interfaces, or debonded interfaces, and did not identify the above five Provides an effective identification method for different types of interfaces (rigidly bonded, weakly bonded, slip, contact, and debonded)

Method used

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  • Detection method of interface morphology of multilayer bonded structure
  • Detection method of interface morphology of multilayer bonded structure
  • Detection method of interface morphology of multilayer bonded structure

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Embodiment example

[0070] This implementation case includes the following steps:

[0071] 1) If the frequency f of the longitudinal wave is 1 MHz, and the thickness h of the adhesive layer is 0.02 mm, these two parameters are substituted into the four equations of the expression (11) in step 1.9. Order K N (2) =8×10 16 (N / m 3 ), K T (2) =3×10 16 (N / m 3 ) indicates that interface 2 of the bonded structure is a rigid connection interface. Order K N (1) =8×10 16 (N / m 3 ), K T (1) =3×10 16 (N / m 3 ) indicates that the interface 1 of the bonded structure is a rigid connection interface; let K N (1) =7×10 13 (N / m 3 ), K T (1) =3×10 12 (N / m 3 ) indicates that the interface 1 of the bonding structure is a weakly bonding interface; let K N (1) =8×10 16 (N / m 3 ), K T (1) → 0 means that the interface 1 of the bonded structure is a slip interface; let K N (1) =7×10 13 (N / m 3 ), K T (1) → 0 means interface 1 of the bonded structure is the contact interface; let K N (1) →0,...

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Abstract

Disclosed is a method of detecting interfacial configuration of a multilayer adhesive structure. On the basis of a control equation of wave propagation, mechanical characteristics of an adhesive interface are represented via nominal and tangential rigidity coefficients so as to deduce an expression of reflection and transmission coefficients of longitudinal and transverse waves in the multilayer adhesive structure at the time of incoming of the ultrasonic longitudinal wave; taking an aluminum-epoxy resin-aluminum adhesive structure as an example, when incoming frequency f of the longitudinal wave and thickness h of an adhesive layer are of certain fixed values, the relation of the incoming angle to the reflection and transmission characteristics of the longitudinal and transverse waves in different interfacial configurations is analyzed; similarly, under the condition of the incoming angles 0 DEG and 30 DEG of the longitudinal wave, the influence of a frequency-thickness product upon reflection and transmission characteristics of the acoustical wave is discussed; meanwhile, which manner is taken to identify the interfacial configuration is explained. Compared with other detection methods, the method which is simple, effective and practicable is suitable for identifying the interfacial configurations of the adhesive structures.

Description

technical field [0001] The invention belongs to the field of non-destructive testing, and in particular relates to a method for testing the interface shape of a multilayer bonding structure. Background technique [0002] Adhesive structures have been widely used in the fields of machinery, electronics, construction, aerospace and so on. For the bonding of different materials, the selected adhesives and bonding quality control techniques are also different. Factors such as improper selection of adhesives and unqualified bonding interface processing technology are likely to cause a decrease in bonding strength and seriously affect the mechanical properties of the bonded structure. In order to ensure the mechanical strength and stability of the bonding structure during service, it is necessary to conduct non-destructive testing and evaluation of the performance of the bonding interface. Therefore, the research on the mechanical behavior of bonding interface and its characteri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N29/04G01N29/44
Inventor 吴斌丁俊才何存富
Owner BEIJING UNIV OF TECH
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