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High-heat ceramic plate

A ceramic chip, high-heat technology, applied in the direction of electric heating devices, ohmic resistance heating, electrical components, etc., can solve the problem of slow heating speed, and achieve the effect of avoiding leakage and rapid high-temperature heating

Inactive Publication Date: 2015-07-22
池州信安电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a high-heat ceramic sheet to solve the existing problem of slow heating speed

Method used

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Embodiment Construction

[0017] In the following, numerous specific details are set forth in order to provide a thorough understanding of the concepts underlying the described embodiments. It will be apparent, however, to one skilled in the art that the described embodiments may be practiced without some or all of these specific details. In other instances, well known processing steps have not been described in detail.

[0018] Such as figure 1 , figure 2 As shown, it includes ceramic sheet 1, resistance paste 2, electrode silver paste 3, sealing paste 4, positive terminal 101, negative terminal 102, ground rod 103, and square resistance 201. The resistance paste 2 is located on the ceramic sheet 1 At the center of the top, the two are glued together, the electrode silver paste 3 is located at the center of the top of the resistance paste 2, the two are glued together, and the sealing paste 4 is located at the center of the top of the electrode silver paste 3, the two Glued together. The left sid...

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Abstract

The invention discloses a high-heat ceramic plate which is characterized by comprising a ceramic plate body, resistor slurry, electrode silver slurry and sealing slurry, wherein the resistor slurry is placed in the top center of the ceramic plate body and glued to the ceramic plate body, the electrode silver slurry is placed in the top center of the resistor slurry and glued to the resistor slurry, and the sealing slurry is placed in the top center of the electrode silver slurry and glued to the electrode silver slurry. Compared with the prior art, the high-heat ceramic plate uses ceramic as a conduction carrier, the resistor slurry is coated to provide a heat source, the electrode silver slurry is coated to play a good conductive role, and the sealing slurry is finally coated to seal the whole mechanism and avoid electric leakage. The ceramic plate can be quickly heated at high temperature, and satisfies the demand of people.

Description

technical field [0001] The invention relates to a heating chip, in particular to a high-heat ceramic chip. Background technique [0002] In the daily application process, water heaters, kettles, etc. need to generate heat. The traditional heating methods mostly use heating pipes or open flames, but they all need a long time to wait and cannot meet people’s needs for rapid use. In view of the above defects, there are It is necessary to design a high heat ceramic chip. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a high-heat ceramic sheet to solve the existing problem of slow heating speed. [0004] In order to solve the above technical problems, the technical solution of the present invention is: a high-heat ceramic sheet, which is characterized in that it includes a ceramic sheet, a resistance paste, an electrode silver paste, and a sealing paste, and the resistance paste is located at the center of the top o...

Claims

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Application Information

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IPC IPC(8): H05B3/22
Inventor 方超汤中原
Owner 池州信安电子科技有限公司
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