Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Turning pick-and-place machine

A pick-and-place machine and pick-and-place device technology, which is used in the direction of assembling printed circuits with electrical components

Inactive Publication Date: 2015-07-15
PROTEK SHANGHAI +1
View PDF7 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the currently known method, the cover plate can only be removed manually from the first surface of the circuit board, and then the circuit board is taken out from the first carrier, and the circuit board is turned over to make the circuit board The first surface configured with circuits and electronic components is facing and placed on the second carrier, at this time, the second surface of the circuit board is exposed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Turning pick-and-place machine
  • Turning pick-and-place machine
  • Turning pick-and-place machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0065] A turn-over pick-and-place machine according to a preferred embodiment of the present invention will be described below with reference to related drawings, wherein the same components will be described with the same reference symbols.

[0066] figure 1 It is a partially exploded schematic diagram of a flipping pick-and-place machine according to an embodiment of the present invention, figure 2 for figure 1 The exploded schematic diagram of the cover plate, workpiece and first carrier shown, please also refer to figure 1 and figure 2 shown. The overturn pick-and-place machine M of this embodiment is used to overturn a workpiece P, and place the overturned workpiece P on a second carrier C2, such as figure 2 As shown, the workpiece P is sandwiched between a cover plate T and a first carrier C1, so the flip pick-and-place machine M must first remove the cover plate T from the workpiece P, so that the workpiece P can be taken out and turned over, and Place the flipp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a turning pick-and-place machine comprising a displacement device, a transmission device, a pick-and-place device, and a turning device. The transmission device has a first station, a second station, and a third station. The first station carries a work piece which is clamped between a tablet and a first carrier. The third station carries a second carrier. The pick-and-place device is arranged on the displacement device, and comprises a first pick-and-place module, a second pick-and-place module and a third pick-and-place module. The first pick-and-place module corresponds to the first station to pick the tablet, and the work piece and the first carrier are transmitted to the second carrier. The second pick-and-place module corresponds to the second station to pick the first carrier. The third pick-and-place module corresponds to the third station to put the work piece on the second carrier. The turning device picks the work piece from the second station, turns the work piece, and transmits the work piece to the third pick-and-place module.

Description

technical field [0001] The invention relates to a flip pick and place machine. Background technique [0002] With the vigorous development of science and technology, people continue to pursue thinner and lighter electronic devices, and then apply Surface Mounted Technology (SMT) technology to the printed circuit board (PCB) of electronic devices. The tablet presses the circuit board and carries out the manufacturing process of circuit printing, arrangement of electronic components and soldering to replace the traditional method of fixing electronic components on the circuit board with heat-resistant tape. The surface mount technology can greatly utilize the area of ​​the circuit board, and can use both sides of the circuit board at the same time. In other words, both sides of the circuit board are equipped with circuits and electronic components, thereby greatly reducing the size of the electronic device. [0003] Generally speaking, the base material of the circuit board (...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30
Inventor 林李鑫
Owner PROTEK SHANGHAI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com