Product mixed-processing system and product mixed-processing method

Abstract

The invention discloses a product mixed-processing system and a product mixed-processing method. The product mixed-processing system comprises a recovery system used for setting at least one processing plan for a plurality of wafers, an integrated system, and a client, wherein the integrated system communicates the recovery system with the client. The product mixed-processing method comprises the following steps: at least one processing plan for a plurality of wafers is set in the recovery system; and the integrated system acquires information of the wafers from the client, verifies the at least one processing plan, and transmits the at least one processing plan to the client for execution when the at least one processing plan proves to be correct through verification. Different operations on corresponding wafers in a batch of wafers needing different operations can be carried out at the same time, potential threats brought by manual operation are avoided, and the degree of automation is improved. In addition, the situation in which a wafer is processed repeatedly or not processed is avoided, the production efficiency is improved, and the quality is ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductor product processing management and control systems, in particular to a product mixing processing system and method for recovering multiple wafers of the same batch of products. Background technique [0002] The manufacturing process of integrated circuit wafers is very complicated. An integrated circuit wafer needs to go through hundreds of processes from the raw material wafer to the final product, and each process needs to go through different machines. During the production process, any abnormal state of a machine will affect the quality of the product, and even cause the product to be scrapped directly. Therefore, the factory (Fab) needs to constantly monitor the working status of the machine, and immediately handle the machine and the products being loaded into the machine properly when the machine is abnormal. [0003] After proper processing, the product can continue to complete the f...

AI Technical Summary

Problems solved by technology

Due to the limitations of existing technical means, only a single method of processing can be performed for a batch of products, and some products in the Fab area require different wafers in a batch of products to be taken out of the machine, cancel loading or perform special processing , the existing recovery methods cannot meet the requirements of these areas, then it is necessary to manually operate the machine for product recovery processing operations, because manual operations have high requirements for technicians and are prone to errors, so it will not only affect the processing of products Efficiency, affect the degree of automation of the factory, and the quality of the product cannot be guaranteed

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