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Processing Device

A processing device and workpiece technology, applied in the direction of working carrier, grinding workpiece support, etc., can solve problems such as prone to failure and complex structure, and achieve the effect of reducing manufacturing cost and failure rate

Active Publication Date: 2015-05-27
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the processing device described in Patent Document 1, the transport mechanism requires an air cylinder that advances and retreats in the pressing direction separately from the suction pad that absorbs and transports the workpiece, so the structure becomes complicated.
In addition, if the structure of the device becomes complicated, failures will easily occur accordingly. Therefore, for example, it is necessary to provide a sensor for identifying whether the pressing pad is advancing and retreating normally, thereby making the structure more complicated.

Method used

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Embodiment Construction

[0019] figure 1 The processing device 10 shown is provided with: a temporary loading table 11, which temporarily mounts disc-shaped workpieces such as wafers; a transport member 12, which transports the workpiece temporarily placed on the temporary loading table 11; The stage 13 holds the workpiece conveyed by the conveying member 12 , and the machining member 14 processes the workpiece held on the chuck table 13 . The processing member 14 has a function of performing processing such as grinding or polishing on a workpiece.

[0020] The chuck table 13 has a holding surface 131 parallel to the XY plane, and absorbs and holds a workpiece placed on the holding surface 131 . If the workpiece is warped, there will be a gap between the workpiece and the holding surface 131 , and therefore, the workpiece may not be adsorbed satisfactorily. For example, when the workpiece is ground thin or heat-treated, the workpiece may warp. In order to reliably hold such a workpiece, it is neces...

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PUM

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Abstract

The present invention provides a processing device which can correct the warping of a workpiece without complicating the structure of the device, and can keep the workpiece on a chuck workbench reliably. A conveying pad (21) possesses an absorption surface (211) of absorbing and keeping the central part of the workpiece, a pressing part (22) possesses an annular pressing surface (211) with an internal diameter greater than the external diameter of the conveying pad (21), and a forwarding and withdrawing part penetrates a hole (231) and a shaft (24) and enables the conveying pad (21) to forward and withdraw along a direction vertical with the absorption surface (211) between a position of the absorption surface (211) protruding towards the pressing surface (221) and the position at which the absorption surface (211) and the pressing surface (221) are located in a same plane. A lifting component (26) enables a keeping mechanism (20) keeping the workpiece to move towards the direction of the chuck workbench (13), thereby pressing the workpiece against the chuck workbench (13). Therefore, the forwarding and withdrawing part acts, so that the absorption surface (211) is positioned in the plane same with the pressing surface (221), the warping of the workpiece is corrected, and the chuck workbench (13) keeps the workpiece.

Description

technical field [0001] The present invention relates to a processing device for processing a disc-shaped workpiece. Background technique [0002] When a disc-shaped workpiece such as a wafer is ground thin or is subjected to thermal processing, the workpiece may warp. When grinding or grinding such a warped workpiece, the workpiece cannot be reliably held on the chuck table while the workpiece remains warped. Therefore, there has been proposed a machining device that presses the outer peripheral region of the workpiece with a pressing pad to correct the warpage and hold the workpiece on the chuck table (for example, refer to Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2009-107097 [0004] However, in the processing device described in Patent Document 1, the conveyance mechanism requires an air cylinder that advances and retreats the pressing pad in the pressing direction separately from the suction pad that adsorbs and conveys the workpiec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B41/06B24B37/27
CPCB24B37/27B24B41/06
Inventor 门田宏太郎
Owner DISCO CORP
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