Imidazole-sulfosalicylic acid silver plating solution and electroplating method
A technology of sulfosalicylic acid and electroplating solution, which is applied in the field of silver plating technology, can solve the problems of poor discoloration resistance of the plating layer, insufficient stability of the plating solution, and unsatisfactory weldability, and achieve good stability, discoloration resistance and reliability. Strong weldability effect
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Embodiment 1
[0035] The formula of imidazole-sulfosalicylic acid silver plating electroplating solution is as follows:
[0036]
[0037]
[0038] Plating process conditions: forward pulse width is 1ms, forward duty cycle is 20%, forward average current density is 0.2A / dm 2 , the negative pulse width is 1ms, the negative duty cycle is 20%, and the negative average current density is 0.1A / dm 2 ; The pH is 8, the temperature is 15°C, and the electroplating time is 40min.
Embodiment 2
[0040] The formula of imidazole-sulfosalicylic acid silver plating electroplating solution is as follows:
[0041]
[0042] Plating process conditions: forward pulse width is 1ms, forward duty cycle is 15%, forward average current density is 0.25A / dm 2 , the negative pulse width is 1.5ms, the negative duty cycle is 15%, and the negative average current density is 0.15A / dm 2 ; The pH is 9, the temperature is 20° C., and the electroplating time is 50 minutes.
Embodiment 3
[0044] The formula of imidazole-sulfosalicylic acid silver plating electroplating solution is as follows:
[0045]
[0046]
[0047] Plating process conditions: forward pulse width is 2ms, forward duty cycle is 10%, forward average current density is 0.3A / dm 2 , the negative pulse width is 2ms, the negative duty cycle is 10%, and the negative average current density is 0.2A / dm 2 ; The pH is 9.5, the temperature is 30°C, and the electroplating time is 60min.
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