Delay compensation method and system of copper plating thickness

Abstract

The invention discloses a delay compensation method and system of copper plating thickness, wherein the method comprises the following steps: measuring the initial copper thickness of a circuit board to be plated; plating copper on the circuit board to be plated for preset time t; measuring the current copper thickness of the circuit board to be plated by copper thickness detection equipment; calculating a difference value Hi between the current copper thickness and the preset copper thickness, finishing plating copper when Hi meets preset conditions, or else, continuing to compensate copper plating for time Ti; calculating a difference value Di between the current copper thickness and the initial copper thickness; calculating a plating efficiency value Qi; calculating the compensation time Ti; plating copper on the circuit board to be plated for the compensation time Ti. According to the delay compensation method of copper plating thickness, the compensation time Ti is calculated by modifying and calculating the plating efficiency value Qi, and the copper plating is performed on the circuit board to be plated for the compensation time Ti, so that the thickness of a copper plated layer is more accurate and controllable.

Description

technical field [0001] The invention relates to the field of circuit board electroplating, in particular to a delay compensation method and system for electroplating copper thickness. Background technique [0002] In the circuit board industry, the preparation process of circuit boards mainly includes the following processes: copper clad laminate cutting, drilling and cleaning in holes, pasting photosensitive film, exposure, development, etching, film removal, stacking, lamination, drilling, cleaning and drilling Dirt and copper plating. [0003] The role of the copper plating process is to attach or thicken the copper layer in the drilled hole and on the surface of the circuit. Among them, the copper plating process includes two processes before and after electroless copper plating and electrolytic copper plating. Before electrolytic copper plating, electroless copper plating must first form a conductive layer on the surface of the circuit board, that is, an electroless c...

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Problems solved by technology

[0006] However, the electroplating time required to determine the thickness of the electroplated copper layer through the above-mentioned traditional method still has the following disadvantages: the thickness of the electroplated copper layer obtained in each time period according to the above-mentioned control experiment will vary with the change of the copper plating conditions in the copper plating cylinder , and the changes of these conditions are often uncontrollable, which will cause the thickness of the desired electroplated copper layer to be inconsistent with the actual thickness of the electroplated copper layer

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