OLED packaging structure and OLED packaging method
A technology of encapsulation structure and encapsulation method, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of OLED device performance degradation, large molecular gap, weak binding force, etc., and achieves good packaging effect and manufacturing process. Simple, performance-enhancing effects
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[0035] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0036] see figure 1 , the present invention provides an OLED packaging structure, comprising a packaging cover 1, a substrate 2 opposite to the packaging cover 1, and an OLED disposed on the substrate 2 between the packaging cover 1 and the substrate 2. The device 21 , the desiccant 11 disposed on the encapsulation cover 1 at the periphery of the OLED device 21 , and the sealant 12 at the periphery of the desiccant 11 to bond the encapsulation cover 1 and the substrate 2 .
[0037] Specifically, a circle of grooves 103 is provided on the periphery of the packaging cover plate 1 corresponding to the area of the OLED device 21, and several circles of concave-convex structures 101 are arranged on the periphery of the groove 103, and the desicca...
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