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Encapsulating method

A packaging method and substrate technology, which can be applied to measurement devices, microstructure devices, and manufacturing microstructure devices, etc., can solve the problems that the quality factor of micromechanical gyroscopes is not high enough and cannot meet technical needs, and can improve device stability and improve Device sensitivity, the effect of reducing energy loss

Inactive Publication Date: 2015-04-22
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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Problems solved by technology

[0005] However, the quality factor of the micromachined gyroscope formed by the existing technology is not high enough to meet the technical needs

Method used

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Embodiment Construction

[0027] As mentioned in the background technology, the quality factor of the micromechanical system in the prior art is not high enough, and the reason for the low quality factor is analyzed now: the micromechanical system usually requires a high-vacuum working environment to reduce the influence of air resistance on the micromechanical device . In other words, the performance of micromechanical systems operating in a high vacuum environment is higher; the lower the air resistance, the higher the quality factor. Therefore, increasing the vacuum degree of the packaging cavity can effectively improve the quality factor of the micro-mechanical system, thereby improving the performance of the micro-mechanical system.

[0028] In order to solve the technical problem, the present invention provides a packaging method, including:

[0029] forming a substrate with micromechanical devices formed therein;

[0030] forming a first patterned metal layer on the surface of the substrate; ...

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Abstract

An encapsulating method comprises the steps that a substrate is formed, a micro mechanical device is arranged in the substrate; a first graphical metal layer is formed on the surface of the substrate; exhaust-gas disposal is carried out on the substrate; a handle wafer is arranged, and a second graphical metal layer is formed on the surface of the handle wafer; the first graphical metal layer of the substrate is correspondingly attached to the second graphical metal layer of the handle wafer to achieve wafer bonding. According to the encapsulating method, the vacuum degree in an encapsulated encapsulating cavity can be effectively improved, therefore the read errors of the device in the encapsulating cavity are reduced, the energy loss of the device is reduced, the stability of the device is improved, the sensitivity of the device is improved, and the quality factor of the device is improved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a packaging method. Background technique [0002] The micromechanical gyroscope is an inertial device used to measure the angular velocity of an object. Because it is designed and manufactured using Micro-Electro-Mechanical-System (MEMS) technology, it has the advantages of small size, light weight, suitable for mass production and Due to its low price, it is widely used in consumer electronics products, such as digital cameras, game consoles, smart phones, handheld computers and micro-navigators and other emerging industries. In the preparation process of MEMS, the encapsulation technology of eutectic bonding is mostly used to realize the encapsulation of MEMS. [0003] refer to figure 1 , figure 1 A schematic structural diagram of the conventional eutectic bonding package is shown. The eutectic bonding process includes: using physical vapor deposition (Physical Vapor Depositio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C25/00
CPCB81C1/00134G01C19/5719G01C25/00
Inventor 黄锦才赵波
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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